Inventor

Patryk Gumann

Inventor

Tarrytown, NY, US

Overview

2019–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Nprimary

G06NComputing arrangements based on specific computational models18%

H01PWaveguides17%

H01LSemiconductor devices13%

H10NElectric solid-state devices not otherwise provided for13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

H05KPrinted circuits7%

B82YSpecific uses or applications of nanostructures5%

H03HImpedance networks, e.g. resonant circuits5%

H01BCables3%

H04BTransmission3%

PatentTitleYear

11,107,966Two-sided Majorana fermion quantum computing devices fabricated with ion implant methods2021 11,108,120DC-capable cryogenic microwave filter with reduced Kapitza resistance2021 11,107,965Majorana fermion quantum computing devices fabricated with ion implant methods2021 11,102,879Printed circuit board to dielectric layer transition with controlled impedance and reduced and/or mitigated crosstalk for quantum applications2021 11,005,574Superconducting interposer for optical transduction of quantum information2021 10,984,335Superconducting interposer for the transmission of quantum information for quantum error correction2021 10,978,769Well thermalized stripline formation for high-density connections in quantum applications2021 10,971,790Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications2021 10,964,993Cryogenic-stripline microwave attenuator2021 10,903,541Packaging and thermalization of cryogenic dispersive resistive hybrid attenuators for quantum microwave circuits2021 10,897,069Reduced kapitza resistance microwave filter for cryogenic environments2021 10,891,251Signal connector for microwave circuits2021 10,886,585DC-capable cryogenic microwave filter with reduced Kapitza resistance2021 10,886,586Packaging and thermalization of cryogenic dispersive-resistive hybrid attenuators for quantum microwave circuits2021 10,833,240Thermalization of cryogenic quantum circuits2020 10,833,384Thermalization of microwave attenuators for quantum computing signal lines2020 10,811,588Vertical dispersive readout of qubits of a lattice surface code architecture2020 10,811,748Cryogenic on-chip microwave filter for quantum devices2020 10,790,566Enabling attenuators for quantum microwave circuits in cryogenic temperature range2020 10,790,432Cryogenic device with multiple transmission lines and microwave attenuators2020 10,784,553Well thermalized stripline formation for high-density connections in quantum applications2020 10,784,431Dielectric holder for quantum devices2020 10,749,235Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications2020 10,681,842Monolithic signal carrier device implemented in cryogenic quantum computing applications2020 10,658,340Signal routing in complex quantum systems2020 10,601,096Reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications2020 10,505,245Microwave attenuators on high-thermal conductivity substrates for quantum applications2019 10,476,122Cryogenic-stripline microwave attenuator2019 10,347,605System and method for routing signals in complex quantum systems2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2021Patents assigned to IBM (29)· patent assignee history

2019–2021Based in Tarrytown, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	29	2019–2021

Locations

Location	Patents	Span
Tarrytown, New York, US	29	2019–2021