Inventor
Daniel Kraehmer
Inventor
Essingen, DE
Overview
Patents· 41 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices49%
G02BOptical elements, systems or apparatus30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B82YSpecific uses or applications of nanostructures2%
G21KHandling of particles or ionising radiation not otherwise provided for2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
Y10TTechnical subjects covered by former us classification2%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light1%
G01MTesting static or dynamic balance of machines or structures1%
H01JElectric discharge tubes or discharge lamps1%
PatentTitleYear
10,281,824Microlithography projection objective20199,964,859Lithography projection objective, and a method for correcting image defects of the same20189,955,563EUV light source for generating a usable output beam for a projection exposure apparatus20189,733,395'Microlithographic projection exposure apparatus'20179,645,503'Collector'20179,551,941'Illumination system for an EUV lithography device and facet mirror therefor'20179,535,332'Mask for EUV lithography, EUV lithography system and method for optimising the imaging of a mask'20179,316,922'Lithography projection objective, and a method for correcting image defects of the same'20169,097,984'Microlithography projection objective'20159,063,439'Projection objective for microlithography with stray light compensation and related methods'20158,922,753'Optical system for a microlithographic projection exposure apparatus'20148,879,159'Lithography projection objective, and a method for correcting image defects of the same'20148,767,181'Microlithographic exposure method as well as a projection exposure system for carrying out the method'20148,456,616'Optical system for microlithography'20138,436,985'Combination stop for catoptric projection arrangement'20138,345,222'High transmission, high aperture catadioptric projection objective and projection exposure apparatus'20138,325,426'Projection objective of a microlithographic projection exposure apparatus'20128,213,079'Polarization-modulating optical element and method for manufacturing thereof'20128,208,127'Combination stop for catoptric projection arrangement'20128,126,669'Optimization and matching of optical systems by use of orientation Zernike polynomials'20128,054,557'Lithography projection objective, and a method for correcting image defects of the same'20118,031,326'Illumination system or projection lens of a microlithographic exposure system'20117,982,969'Projection objective of a microlithographic projection exposure apparatus'20117,961,297'Method for determining intensity distribution in the image plane of a projection exposure arrangement'20117,903,333'Polarization-modulating optical element and method for manufacturing thereof'20117,847,921'Microlithographic exposure method as well as a projection exposure system for carrying out the method'20107,808,615'Projection exposure apparatus and method for operating the same'20107,728,975'Method for describing, evaluating and improving optical polarization properties of a microlithographic projection exposure apparatus'20107,710,640'Projection objective of a microlithographic projection exposure apparatus'20107,697,211'Symmetrical objective having four lens groups for microlithography'20107,692,868'Lithography projection objective, and a method for correcting image defects of the same'20107,679,831'Projection objective of a microlithographic projection exposure apparatus'20107,483,121'Microlithograph system'20097,463,423'Lithography projection objective, and a method for correcting image defects of the same'20087,463,422'Projection exposure apparatus'20087,408,616'Microlithographic exposure method as well as a projection exposure system for carrying out the method'20087,317,508'Optical system and method for the production of micro-structured components by microlithography'20087,239,447'Objective with crystal lenses'20077,239,450'Method of determining lens materials for a projection exposure apparatus'20076,992,834'Objective with birefringent lenses'20066,806,942'Projection exposure system'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to ZEISS CARL SMT AG (16)· patent assignee history
2004Based in Oberkochen, DE· patent location history
2006–2014Based in Aalen, DE· patent location history
2008–2019Based in Essingen, DE· patent location history
2011–2019Patents assigned to ZEISS CARL SMT GMBH (24)· patent assignee history
2012–2017Patents assigned to KRAEHMER DANIEL (11)· patent assignee history
2012–2017Patents assigned to GRUNER TORALF (5)· patent assignee history
2012–2015Patents assigned to TOTZECK MICHAEL (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ZEISS CARL SMT GMBH | 24 | 2011–2019 |
| ZEISS CARL SMT AG | 16 | 2004–2010 |
| KRAEHMER DANIELself | 11 | 2012–2017 |
| GRUNER TORALF | 5 | 2012–2017 |
| TOTZECK MICHAEL | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Essingen, DE | 27 | 2008–2019 |
| Aalen, DE | 13 | 2006–2014 |
| Oberkochen, DE | 1 | 2004 |