Inventor
Charles R. Davis
Inventor
Endicott, NY, US
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits18%
Y10TTechnical subjects covered by former us classification16%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H01RElectrically-conductive connections7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
B23KSoldering or unsoldering4%
B29CShaping or joining of plastics2%
C23CCoating metallic material2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
7,294,565'Method of fabricating a wire bond pad with Ni/Au metallization'20077,098,676'Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor'20067,009,280'Low-k interlevel dielectric layer (ILD)'20066,975,722'Dual echo canceller with fast reflector identification'20056,912,281'Route delay sensitive echo cancellation'20056,815,346'Unique feature design enabling structural integrity for advanced low k semiconductor chips'20046,650,010'Unique feature design enabling structural integrity for advanced low K semiconductor chips'20036,531,759'Alpha particle shield for integrated circuit'20036,486,557'Hybrid dielectric structure for improving the stiffness of back end of the line structures'20025,872,337'Chip carrier and cable assembly reinforced at edges'19995,833,666'Catheter fixation assembly'19985,789,121'High density template: materials and processes for the application of conductive pastes'19985,709,805'Method for producing multi-layer circuit board and resulting article of manufacture'19985,679,444'Method for producing multi-layer circuit board and resulting article of manufacture'19975,626,771'Design of high density structures with laser etch stop'19975,620,782'Method of fabricating a flex laminate package'19975,536,579'Design of high density structures with laser etch stop'19965,509,196'Method of fabricating a flex laminate package'19965,460,921'High density pattern template: materials and processes for the application of conductive pastes'19955,421,507'Au-Sn transient liquid bonding in high performance laminates'19955,384,690'Flex laminate package for a parallel processor'19955,357,005'Reactive surface functionalization'19945,340,451'Process for producing a metal organic polymer combination'19945,280,414'Au-Sn transient liquid bonding in high performance laminates'19945,208,068'Lamination method for coating the sidewall or filling a cavity in a substrate'19935,206,074'Adhesives on polymide films and methods of preparing them'19935,059,363'Method for extruding silicone tubing'19914,787,077'Process for optically storing information using materials having a single phase in both the crystalline state and the amorphous state'19884,722,160'Combination grave marker and flower receptacle'19884,651,337'Film positioner'19874,230,906'Speech digitizer'1980Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1980Patents assigned to TIME AND SPACE PROCESSING INC (1)· patent assignee history
1987Patents assigned to GEN ELECTRIC (1)· patent assignee history
1988–2007Patents assigned to IBM (24)· patent assignee history
1988Patents assigned to DAVIS CHARLES R (1)· patent assignee history
1993–1998Based in Endicott, NY, US· patent location history
1996–1998Based in Wappingers Falls, NY, US· patent location history
1999Based in Jericho, VT, US· patent location history
2002–2007Based in Fishkill, NY, US· patent location history
2005Patents assigned to TEXAS INSTRUMENTS INC (2)· patent assignee history
2005Based in Palo Alto, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 1988–2007 |
| TEXAS INSTRUMENTS INC | 2 | 2005 |
| DAVIS CHARLES Rself | 1 | 1988 |
| GEN ELECTRIC | 1 | 1987 |
| TIME AND SPACE PROCESSING INC | 1 | 1980 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 10 | 1993–1998 |
| Fishkill, New York, US | 7 | 2002–2007 |
| Wappingers Falls, New York, US | 4 | 1996–1998 |
| Palo Alto, California, US | 2 | 2005 |
| Jericho, VT, US | 1 | 1999 |