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Inventor

Kazunari Suzuki

Inventor
Tokyo, JP

Overview

68→
Patents
1989–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
Y10TTechnical subjects covered by former us classification9%
H04LTransmission of digital information, e.g. telegraphic communication8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H04WWireless communication networks5%
B08BCleaning in general3%
H10DInorganic electric semiconductor devices3%
G06FElectric digital data processing3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
C08LCompositions of macromolecular compounds2%
PatentTitleYear
10,688,704Mold clamping device and method202010,462,280Device and method for using appropriate telephone number for call connection20199,901,962'Ultrasonic cleaning apparatus'20189,838,546Notification apparatus, notification system, notification method, and program20179,661,494'Control apparatus, control method, communication system and program'20179,313,650'Communications system, mobile communications device, transition control device, transition control method, and transition control program'20169,237,091'System and method of load balancing for ethernet link aggregation'20168,960,208'Ultrasonic cleaning device'20158,448,655'Ultrasonic cleaning device'20138,378,459'Semiconductor device, semiconductor wafer and manufacturing method of the same'20138,300,822'System for secure packet communication'20128,274,980'Ethernet link aggregation'2012RE043443'Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two'20128,156,646'Method for manufacturing printed wiring board'20127,943,861'Printed wiring board and method for manufacturing printed wiring board'20117,869,358'Communication relay apparatus, information management system, and control method and program therefor'20117,869,597'Method and system for secure packet communication'20117,759,224'Fabrication method of semiconductor integrated circuit device'20107,678,706'Method of manufacturing a semiconductor device'20107,647,420'Apparatus and method for controlling storage device'20107,605,682'Magnetic core type laminated inductor'20097,541,667'Semiconductor device and method of manufacturing the same'20097,528,014'Semiconductor device and method of manufacturing the same'20097,466,649'Method for setting a value of waiting time for switching'20087,452,787'Fabrication method of semiconductor integrated circuit device'20087,422,024'Ultrasonic shower cleaning apparatus of double-side cleaning type'20087,323,788'Semiconductor device and manufacturing method of them'20087,247,576'Method of manufacturing a semiconductor device'20077,211,903'Semiconductor device and manufacturing method of them'20077,199,469'Semiconductor device having stacked semiconductor chips sealed with a resin seal member'20077,176,060'Integrated circuit card and a method of manufacturing the same'20077,148,081'Method of manufacturing a semiconductor device'20067,074,844'Adhesives'20067,015,069'Method of manufacturing a semiconductor device and a semiconductor device'20066,989,334'Manufacturing method of a semiconductor device'20066,960,823'Semiconductor device and method of manufacturing the same'20056,943,456'Plastic molded type semiconductor device and fabrication process thereof'20056,916,686'Method of manufacturing a semiconductor device'20056,872,597'Method of manufacturing a semiconductor device and a semiconductor device'20056,853,089'Semiconductor device and method of manufacturing the same'20056,803,258'Semiconductor device'20046,723,020'Planetary carrier and method of manufacture'20046,723,583'Method of manufacturing a semiconductor device using a mold'20046,692,989'Plastic molded type semiconductor device and fabrication process thereof'20046,673,655'Method of making semiconductor device having improved heat radiation plate arrangement'20046,596,561'Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture'20036,558,980'Plastic molded type semiconductor device and fabrication process thereof'20036,476,479'Semiconductor device and method of fabricating the same'20026,445,076'Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same'20026,441,400'Semiconductor device and method of fabricating the same'20026,396,142'Semiconductor device'20026,372,554'Semiconductor integrated circuit device and method for production of the same'20026,340,837'Semiconductor device and method of fabricating the same'20026,291,273'Plastic molded type semiconductor device and fabrication process thereof'20016,221,322'Strontium nitrate and method for manufacturing same'20015,874,773'Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids'19995,869,888'Semiconductor device with lead structure on principal surface of chip'19995,714,405'Semiconductor device'19985,637,913'Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two'19975,583,375'Semiconductor device with lead structure within the planar area of the device'19965,543,189'Resin compositions, production process thereof, and products using the resin compositions'19965,492,970'Resin compositions, production process thereof, and products using the resin compositions'19965,378,656'Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same'19955,283,892'Method and apparatus for file operation'19945,243,691'System for printing documents'19934,954,818'Multi-window display control system'19904,829,468'Print control system'19894,803,543'Semiconductor device and process for producing the same'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2009Patents assigned to HITACHI LTD (22)· patent assignee history
1989–2019Based in Tokyo, JP· patent location history
1989–1994Based in Yokohama, JP· patent location history
2001–2012Patents assigned to HITACHI ULSI SYS CO LTD (18)· patent assignee history
2004–2010Patents assigned to RENESAS TECH CORP (13)· patent assignee history
2007–2010Based in Ota, JP· patent location history
2008–2016Patents assigned to IBM (7)· patent assignee history
2010–2016Based in Chiba, JP· patent location history
2012–2018Patents assigned to SUZUKI KAZUNARI (8)· patent assignee history
2013–2015Based in Hamura, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD221989–2009
HITACHI ULSI SYS CO LTD182001–2012
RENESAS TECH CORP132004–2010
SUZUKI KAZUNARIself82012–2018
IBM72008–2016
Locations
LocationPatentsSpan
Tokyo, JP421989–2019
Chiba, JP52010–2016
Ota, JP42007–2010
Yokohama, JP41989–1994
Hamura, JP22013–2015