Inventor
Teak-Hoon Lee
Inventor
Hwaseong-si, KR
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H01LSemiconductor devices18%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
10,867,857Method of cutting substrate and method of singulating semiconductor chips20209,721,930'Semiconductor package and method for fabricating the same'20179,159,651'Semiconductor packages having TSV and adhesive layer'20159,136,260'Method of manufacturing chip-stacked semiconductor package'20159,082,871'Substrate of semiconductor package and method of fabricating semiconductor package using the same'20158,987,904'Substrate of semiconductor package and method of fabricating semiconductor package using the same'20158,846,446'Semiconductor package having buried post in encapsulant and method of manufacturing the same'20148,637,969'Stacked chips in a semiconductor package'20148,637,350'Method of manufacturing chip-stacked semiconductor package'20148,455,301'Method of fabricating stacked chips in a semiconductor package'20138,344,497'Semiconductor package and electronic device having the same'20138,154,122'Semiconductor package and methods of manufacturing the semiconductor package'20128,093,703'Semiconductor package having buried post in encapsulant and method of manufacturing the same'20128,008,771'Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device'20117,807,512'Semiconductor packages and methods of fabricating the same'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (15)· patent assignee history
2010–2015Based in Hwaseong-si, KR· patent location history
2011–2015Based in Gyeonggi-do, KR· patent location history
2012–2014Patents assigned to LEE TEAK-HOON (7)· patent assignee history
2012–2014Patents assigned to JANG CHUL-YONG (4)· patent assignee history
2012–2014Patents assigned to KIM PYOUNG-WAN (4)· patent assignee history
2013–2014Patents assigned to IM SUNG-JUN (3)· patent assignee history
2015Based in Yongin-si, KR· patent location history
2017Based in Daejeon, KR· patent location history
2020Based in Jung-gu, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 15 | 2010–2020 |
| LEE TEAK-HOONself | 7 | 2012–2014 |
| JANG CHUL-YONG | 4 | 2012–2014 |
| KIM PYOUNG-WAN | 4 | 2012–2014 |
| IM SUNG-JUN | 3 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 7 | 2010–2015 |
| Gyeonggi-do, KR | 4 | 2011–2015 |
| Jung-gu, KR | 1 | 2020 |
| Daejeon, KR | 1 | 2017 |
| Yongin-si, KR | 1 | 2015 |