Inventor

Hui-Chen J. Lai

Inventor
New Taipei, TW

Overview

2→
Patents
1991–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B29LIndexing scheme associated with subclass b29c, relating to particular articles17%
C12NMicroorganisms or enzymes17%
H02KDynamo-electric machines17%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management17%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991Patents assigned to CIBA GEIGY CORP (1)· patent assignee history
1991Patents assigned to PENNSYLVANIA RES CORP (1)· patent assignee history
1991Based in State College, PA, US· patent location history
2021Patents assigned to GALLANT MICRO MACHINING CO LTD (1)· patent assignee history
2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CIBA GEIGY CORP11991
GALLANT MICRO MACHINING CO LTD12021
PENNSYLVANIA RES CORP11991
Locations
LocationPatentsSpan
New Taipei, TW12021
State College, Pennsylvania, US11991