Inventor
Hui-Chen J. Lai
Inventor
New Taipei, TW
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B29LIndexing scheme associated with subclass b29c, relating to particular articles17%
C12NMicroorganisms or enzymes17%
H02KDynamo-electric machines17%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management17%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Patents assigned to CIBA GEIGY CORP (1)· patent assignee history
1991Patents assigned to PENNSYLVANIA RES CORP (1)· patent assignee history
1991Based in State College, PA, US· patent location history
2021Patents assigned to GALLANT MICRO MACHINING CO LTD (1)· patent assignee history
2021Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CIBA GEIGY CORP | 1 | 1991 |
| GALLANT MICRO MACHINING CO LTD | 1 | 2021 |
| PENNSYLVANIA RES CORP | 1 | 1991 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 1 | 2021 |
| State College, Pennsylvania, US | 1 | 1991 |