Inventor

Dae Hyun Park

Inventor
Suwon-si, KR

Overview

42→
Patents
2009–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 42 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices14%
H01PWaveguides10%
Y10TTechnical subjects covered by former us classification6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
H01JElectric discharge tubes or discharge lamps2%
H01QAntennas, i.e. radio aerials2%
B62BHand-propelled vehicles, e.g. hand carts or perambulators1%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes1%
PatentTitleYear
10,762,479Method and system for processing blockchain-based real-time transaction202010,667,386Circuit board and conductive pattern structure202010,600,679Fan-out semiconductor package202010,553,541Fan-out semiconductor package202010,333,193Printed circuit board and printed circuit board for camera module201910,304,807Fan-out semiconductor package201910,262,949Fan-out semiconductor package and method of manufacturing the same201910,256,200Electronic component package and method of manufacturing the same201910,251,259Circuit board and conductive pattern structure201910,217,631Fan-out semiconductor package201910,199,337Electronic component package and method of manufacturing the same201910,157,886Fan-out semiconductor package201810,157,851Fan-out semiconductor package201810,121,769Fan-out semiconductor package201810,083,929Fan-out semiconductor package20189,984,979Fan-out semiconductor package and method of manufacturing the same20189,853,003Fan-out semiconductor package20179,526,164'Printed circuit board and manufacturing method thereof'20169,496,594'Printed circuit board and printed circuit board for camera module'20169,313,893'Substrate having electronic component embedded therein and method of manufacturing the same'20169,180,899'Shopping cart tray'20158,952,265'Electromagnetic interference noise reduction package board'20158,853,560'Electromagnetic bandgap structure and printed circuit board'20148,699,234'EMI noise shield board including electromagnetic bandgap structure'20148,420,949'Electromagnetic bandgap structure and printed circuit board'20138,422,248'Electromagnetic bandgap structure and printed circuit board'20138,289,099'Electromagnetic bandgap structure and circuit board'20128,279,616'Printed circuit board with embedded chip capacitor'20128,258,408'Electromagnetic interference noise reduction board using electromagnetic bandgap structure'20128,253,025'Printed circuit board having electromagnetic bandgap structure'20128,242,377'Printed circuit board having electromagnetic bandgap structure'20128,227,704'Printed circuit board having electromagnetic bandgap structure'20128,212,150'Electromagnetic interference noise reduction board using electromagnetic bandgap structure'20128,183,468'Electromagnetic bandgap structure, printed circuit board comprising this and method thereof'20128,153,907'Electromagnetic bandgap structure and printed circuit board'20128,081,052'Electromagnetic bandgap structure and printed circuit board'20118,076,998'Electromagnetic bandgap structure and printed circuit board'20118,035,991'Electromagnetic bandgap structure and printed circuit board'20117,965,521'Electromagnetic bandgap structure and printed circuit board'20117,876,045'Plasma display panel having barrier ribs with pigments with different mixing ratios'20117,764,149'Electromagnetic bandgap structure and printed circuit board'20107,563,149'Sheet for manufacturing plasma display apparatus and method for manufacturing plasma display'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2012Based in Yongin-si, KR· patent location history
2010–2020Patents assigned to SAMSUNG ELECTRO MECH (36)· patent assignee history
2010–2014Based in Ulsan, KR· patent location history
2011–2015Patents assigned to KIM HAN (16)· patent assignee history
2011–2015Patents assigned to PARK DAE-HYUN (16)· patent assignee history
2011–2014Patents assigned to BONG KANG-WOOK (6)· patent assignee history
2011–2020Based in Suwon-si, KR· patent location history
2012–2014Patents assigned to HAN MI-JA (10)· patent assignee history
2015Based in La Mirada, CA, US· patent location history
2020Based in Seoul, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRO MECH362010–2020
KIM HAN162011–2015
PARK DAE-HYUNself162011–2015
HAN MI-JA102012–2014
BONG KANG-WOOK62011–2014
Locations
LocationPatentsSpan
Suwon-si, KR222011–2020
Ulsan, KR112010–2014
Yongin-si, KR72009–2012
Seoul, KR12020
La Mirada, California, US12015