Inventor
Hideko Ando
Inventor
Ome, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H05KPrinted circuits35%
Y02PClimate change mitigation technologies in the production or processing of goods12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
8,076,771'Semiconductor device having metal cap divided by slit'20117,035,081'Semiconductor device'20066,911,734'Semiconductor device and electronic device'20056,911,733'Semiconductor device and electronic device'20056,747,356'Semiconductor device'20046,433,412'Semiconductor device and a method of manufacturing the same'20026,380,621'Semiconductor device and manufacturing method thereof'20026,111,322'Semiconductor device and manufacturing method thereof'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2006Patents assigned to HITACHI LTD (7)· patent assignee history
2000–2002Based in Hamura, JP· patent location history
2004–2006Based in Ome, JP· patent location history
2011Patents assigned to ANDO HIDEKO (1)· patent assignee history
2011Patents assigned to RENESAS ELECTRONICS CORP (1)· patent assignee history
2011Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 7 | 2000–2006 |
| ANDO HIDEKOself | 1 | 2011 |
| RENESAS ELECTRONICS CORP | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ome, JP | 4 | 2004–2006 |
| Hamura, JP | 3 | 2000–2002 |
| Kawasaki, JP | 1 | 2011 |