Inventor
JAI KWANG HAN
Inventor
JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing50%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
PatentTitleYear
11,858,088Polishing apparatus2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024Patents assigned to DISCO CORP (1)· patent assignee history
2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 1 | 2024 |