Inventor
Anton Leidl
Inventor
Hohenbrunn, DE
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Rprimary
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
B81BMicrostructural devices or systems, e.g. micromechanical devices16%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems9%
H03HImpedance networks, e.g. resonant circuits7%
H01LSemiconductor devices6%
H03GControl of amplification4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H03FAmplifiers3%
PatentTitleYear
10,683,201Resiliently mounted sensor system with damping202010,622,957Integrated circuit, circuit assembly and a method for its operation202010,581,397Integrated circuit, circuit assembly and a method for its operation202010,142,729Microphone and method of operating a microphone201810,136,226Top-port MEMS microphone and method of manufacturing the same20189,278,854'Method for producing a sensor'20169,061,888'Sensor module and method for producing sensor modules'20159,056,760'Miniaturized electrical component comprising an MEMS and an ASIC and production method'20158,865,499'MEMS microphone and method for producing the MEMS microphone'20148,713,789'Method of manufacturing a microphone'20148,674,464'MEMS component, method for producing a MEMS component, and method for handling a MEMS component'20148,624,466'Component having stress-reduced mounting'20148,611,566'MEMS-microphone'20138,582,788'MEMS microphone'20138,580,613'Semiconductor chip arrangement with sensor chip and manufacturing method'20138,571,239'MEMS microphone'20138,553,920'Arrangement comprising a microphone'20138,432,007'MEMS package and method for the production thereof'20138,393,214'Rotating motion sensor'20138,184,845'Electrical module comprising a MEMS microphone'20128,169,041'MEMS package and method for the production thereof'20128,009,407'Adjustable capacitor and circuit provided therewith'20117,998,805'Component with sensitive component structures and method for the production thereof'20117,589,452'SAW-component having a reduced temperature path and method for the production thereof'20097,459,991'SAW component having an improved temperature coefficient'20087,411,291'Component with sensitive component structures and method for the production thereof'20087,345,409'Electrode structure for electro-acoustic component and method for producing said structure'20086,774,645'Device and method for detecting deposit formations on sensor surfaces where lubricants cause the formations'20046,186,005'Surface wave liquid sensor'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2004Based in Munich, DE· patent location history
2008–2018Patents assigned to EPCOS AG (24)· patent assignee history
2008–2020Based in Hohenbrunn, DE· patent location history
2012–2015Patents assigned to LEIDL ANTON (15)· patent assignee history
2012–2015Patents assigned to PAHL WOLFGANG (11)· patent assignee history
2012–2015Patents assigned to KRUEGER HANS (5)· patent assignee history
2013–2015Patents assigned to FEIERTAG GREGOR (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EPCOS AG | 24 | 2008–2018 |
| LEIDL ANTONself | 15 | 2012–2015 |
| PAHL WOLFGANG | 11 | 2012–2015 |
| FEIERTAG GREGOR | 7 | 2013–2015 |
| KRUEGER HANS | 5 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hohenbrunn, DE | 27 | 2008–2020 |
| Munich, DE | 2 | 2001–2004 |