Inventor
Kyuil CHO
Inventor
US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H05KPrinted circuits14%
H01QAntennas, i.e. radio aerials10%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10KOrganic electric solid-state devices5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
12,388,049High connectivity device stacking202512,374,611Package core assembly and fabrication methods202512,354,968Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202512,087,679Package core assembly and fabrication methods202411,925,073Stretchable polymer and dielectric layers for electronic displays202411,887,934Package structure and fabrication methods202411,881,447Package core assembly and fabrication methods202411,862,546Package core assembly and fabrication methods202411,798,831Method for substrate registration and anchoring in inkjet printing202311,742,330High connectivity device stacking202311,715,700Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202311,705,365Methods of micro-via formation for advanced packaging202311,521,935Package structure and fabrication methods202211,476,202Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,398,433Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,388,822Methods for improved polymer-copper adhesion202211,367,643Method for substrate registration and anchoring in inkjet printing202211,362,307Encapsulation having polymer and dielectric layers for electronic displays202211,342,256Method of fine redistribution interconnect formation for advanced packaging applications202211,329,003Anchoring dies using 3D printing to form reconstructed wafer202211,322,381Method for substrate registration and anchoring in inkjet printing202211,281,094Method for via formation by micro-imprinting202211,264,331Package structure and fabrication methods202211,264,333Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,258,045Methods of forming stretchable encapsulation for electronic displays202211,257,790High connectivity device stacking202211,211,439Stretchable polymer and dielectric layers for electronic displays2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to APPLIED MATERIALS INC (27)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 27 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 27 | 2021–2025 |