Inventor
Curtis M. Medlen
Inventor
Boise, ID, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
G01RMeasuring electric variables19%
Y10TTechnical subjects covered by former us classification19%
B23KSoldering or unsoldering15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
PatentTitleYear
6,509,256'Methods of forming electrically conductive interconnections and electrically interconnected substrates'20036,359,561'Method of manufacturing and testing an electronic device, and an electronic device'20026,344,792'Method of manufacturing and testing an electronic device, and a electronic device'20026,271,597'Methods for forming electrically conductive interconnections and electrically interconnected substrates'20016,211,785'Method of manufacturing and testing an electronic device, and an electronic device'20016,167,614'Method of manufacturing and testing an electronic device, and an electronic device'20016,143,639'Methods of forming electrically conductive interconnections and electrically interconnected substrates'20006,110,760'Methods of forming electrically conductive interconnections and electrically interconnected substrates'20006,104,280'Method of manufacturing and testing an electronic device, and an electronic device'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2003Patents assigned to MICRON TECHNOLOGY INC (9)· patent assignee history
2000–2003Based in Boise, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 9 | 2000–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 9 | 2000–2003 |