Inventor
Xunqing Shi
Inventor
Hong Kong, CN
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification12%
H05KPrinted circuits8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
B23KSoldering or unsoldering4%
C04BLime, magnesia4%
C23CCoating metallic material4%
G06FElectric digital data processing4%
H01LSemiconductor devices4%
PatentTitleYear
10,014,280Three dimensional fully molded power electronics module having a plurality of spacers for high power applications20189,075,941'Method for optimizing electrodeposition process of a plurality of vias in wafer'20159,066,424'Partitioned hybrid substrate for radio frequency applications'20158,772,930'Increased surface area electrical contacts for microelectronic packages'20148,674,482'Semiconductor chip with through-silicon-via and sidewall pad'20148,544,165'Apparatus for aligning electronic components'20138,232,626'Via and method of via forming and method of via filling'20128,212,297'High optical efficiency CMOS image sensor'20128,194,411'Electronic package with stacked modules with channels passing through metal layers of the modules'20128,138,577'Pulse-laser bonding method for through-silicon-via based stacking of electronic components'20128,030,208'Bonding method for through-silicon-via based 3D wafer stacking'20117,879,438'Substrate warpage-reducing structure'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Patents assigned to HK APPLIED SCIENCE & TECH RES (11)· patent assignee history
2011–2012Based in Taiwai, HK· patent location history
2011Based in Fanling, HK· patent location history
2012–2014Patents assigned to SHI XUNQING (7)· patent assignee history
2012–2014Patents assigned to XIE BIN (3)· patent assignee history
2012–2014Patents assigned to YANG DAN (3)· patent assignee history
2012–2014Patents assigned to CHUNG CHANG HWA (2)· patent assignee history
2012–2018Based in Hong Kong, CN· patent location history
2012Based in Singapore, SG· patent location history
2014Based in New Territories, HK· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HK APPLIED SCIENCE & TECH RES | 11 | 2011–2015 |
| SHI XUNQINGself | 7 | 2012–2014 |
| XIE BIN | 3 | 2012–2014 |
| YANG DAN | 3 | 2012–2014 |
| CHUNG CHANG HWA | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hong Kong, CN | 7 | 2012–2018 |
| Taiwai, HK | 2 | 2011–2012 |
| New Territories, HK | 1 | 2014 |
| Singapore, SG | 1 | 2012 |
| Fanling, HK | 1 | 2011 |