Inventor
Jeong Min Kweon
Inventor
Kyungki-do, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds33%
C09JAdhesives17%
H05KPrinted circuits17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%
PatentTitleYear
6,452,282'Insulating adhesive tape for a semiconductor chip package having a copper lead frame'20026,320,019'Method for the preparation of polyamic acid and polyimide'20016,307,008'Polyimide for high temperature adhesive'20016,252,033'Method for the preparation of polyamic acid and polymide useful for adhesives'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Patents assigned to SAEHAN IND INC (2)· patent assignee history
2001Patents assigned to SAEHAN IND CORP (1)· patent assignee history
2001–2002Based in Kyungki-do, KR· patent location history
2002Patents assigned to SAEHAN MICRONICS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAEHAN IND INC | 2 | 2001 |
| SAEHAN IND CORP | 1 | 2001 |
| SAEHAN MICRONICS INC | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyungki-do, KR | 4 | 2001–2002 |