Inventor
LI-HUI CHENG
Inventor
TW
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10DInorganic electric semiconductor devices3%
G02BOptical elements, systems or apparatus2%
H05KPrinted circuits1%
PatentTitleYear
12,519,094Package structure and method of fabricating the same202612,500,134Package assembly including a package lid having a step region and method of making the same202512,494,401Semiconductor package and method202512,463,108Semiconductor device and manufacturing method thereof202512,412,802Heat dissipation structures for integrated circuit packages and methods of forming the same202512,368,090Method of manufacturing semiconductor device including passivation layer202512,368,084Package structure and manufacturing method thereof202512,362,260Methods of packaging semiconductor devices and packaged semiconductor devices202512,300,574Adhesive and thermal interface material on a plurality of dies covered by a lid202512,278,162Coplanar control for film-type thermal interface202512,266,633Semiconductor structure and method of forming the same202512,237,291Dummy structure of stacked and bonded semiconductor device202512,230,609Semiconductor packages202512,224,224Package structure with metallic layer over the surfaces of a plurality of semiconductor dies202512,218,117Method of forming package structure and package structure therefrom202512,211,818Manufacturing method of semiconductor package using jig202512,176,261Method of fabricating package structure202412,170,236Method for forming package structure202412,132,004Semiconductor devices and methods of manufacture202412,100,640High efficiency heat dissipation using thermal interface material film202412,068,173Package structure and manufacturing method thereof202412,057,432Integrated fan-out package structures with recesses in molding compound202412,033,912Package structure and manufacturing method thereof202411,996,345Package structure and manufacturing method thereof202411,973,005Coplanar control for film-type thermal interface202411,942,403Integrated circuit package and method202411,923,259Package structure and method of manufacturing the same202411,901,255Semiconductor device and method of forming the same202411,894,287Adhesive and thermal interface material on a plurality of dies covered by a lid202411,869,822Semiconductor package and manufacturing method thereof202411,855,003Package structure and method of fabricating the same202311,855,054Method of forming package structure202311,830,821Semiconductor devices and methods of manufacture202311,804,468Manufacturing method of semiconductor package using jig202311,756,855Method of fabricating package structure202311,756,802Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device202311,742,323Semiconductor structure and method of forming the same202311,705,381High efficiency heat dissipation using thermal interface material film202311,699,597Package structure and manufacturing method thereof202311,664,286Method for forming package structure202311,626,344Adhesive and thermal interface material on a plurality of dies covered by a lid202311,605,579Semiconductor device having passivation layer and method of manufacturing the same202311,527,418Integrated circuit packages and methods of forming same202211,521,905Package structure and method of manufacturing the same202211,495,526Integrated circuit package and method202211,488,843Underfill between a first package and a second package202211,456,287Package structure and method of fabricating the same202211,424,174Semiconductor device and method of forming the same202211,393,783Dummy structure of stacked and bonded semiconductor device202211,302,683Optical signal processing package structure202211,296,051Semiconductor packages and forming method thereof202211,239,138Methods of packaging semiconductor devices and packaged semiconductor devices202211,239,136Adhesive and thermal interface material on a plurality of dies covered by a lid202211,239,134Package structure and method of fabricating the same202211,205,612Integrated circuit package and method2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (55)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 55 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 55 | 2021–2026 |