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Inventor

Kee-Young Jun

Inventor
Seongnam-si, KR

Overview

2→
Patents
2017–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
9,929,098'Copper via with barrier layer and cap layer'20189,653,400'Semiconductor device and method of manufacturing the same'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2017–2018Based in Seongnam-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD22017–2018
Locations
LocationPatentsSpan
Seongnam-si, KR22017–2018