Inventor
RAJEN MANICON MURUGAN
Inventor
US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H01QAntennas, i.e. radio aerials7%
H05KPrinted circuits6%
H01PWaveguides3%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
G01RMeasuring electric variables2%
H10DInorganic electric semiconductor devices2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
12,599,002Substrate-integrated waveguide202612,519,070System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transition202612,489,211Electronic device with patch antenna in packaging substrate202512,489,061Semiconductor device with multiple dies202512,444,702Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate202512,438,072Multilayer package substrate with stress buffer202512,418,097Microelectronic device package including antenna and semiconductor device202512,406,915Plated metal layer in power packages202512,400,945Electronic device multilevel package substrate for improved electromigration performance202512,394,742Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same202512,381,139Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device202512,322,856Antenna in package having antenna on package substrate202512,266,596Semiconductor device with a power converter module connected to connection assembly202512,243,911Integrated circuit package for isolation dies202512,243,849Passives to facilitate mold compound flow202512,224,480Microelectronic device package including antenna horn and semiconductor device202512,218,036Package substrate having integrated passive device(s) between leads202512,211,800Semiconductor package with shunt and patterned metal trace202512,148,556Integrated magnetic assembly202412,113,293Antenna-on-package including multiple types of antenna202412,040,265High-frequency ceramic packages with modified castellation and metal layer architectures202411,978,709Integrated system-in-package with radiation shielding202411,978,699Electronic device multilevel package substrate for improved electromigration preformance202411,955,479Packaged semiconductor device202411,901,271High current packages with reduced solder layer count202411,881,460Ceramic semiconductor package seal rings202411,837,775Microelectronic device package including antenna and semiconductor device202311,784,113Multilayer package substrate with stress buffer202311,784,114Plated metal layer in power packages202311,600,581Packaged electronic device and multilevel lead frame coupler202311,600,932Antenna-on-package including multiple types of antenna202311,600,555Package substrate having integrated passive device(s) between leads202311,587,891Ceramic semiconductor package seal rings202311,557,722Hall-effect sensor package with added current path202311,545,420High current packages with reduced solder layer count202311,362,047Integrated system-in-package with radiation shielding2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TEXAS INSTRUMENTS INC (35)· patent assignee history
2022–2026Based in US· patent location history
2026Patents assigned to TEXAS INSTR INCORPORATED (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 35 | 2022–2026 |
| TEXAS INSTR INCORPORATED | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 36 | 2022–2026 |