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Inventor

Douglas K. Sturtevant

Inventor
Essex Junction, VT, US

Overview

4→
Patents
1998–2003
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
B24BMachines, devices, or processes for grinding or polishing38%
Y02PClimate change mitigation technologies in the production or processing of goods13%
PatentTitleYear
6,599,173'Method to prevent leaving residual metal in CMP process of metal interconnect'20035,944,583'Composite polish pad for CMP'19995,885,135'CMP wafer carrier for preferential polishing of a wafer'19995,842,910'Off-center grooved polish pad for CMP'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2003Patents assigned to IBM (4)· patent assignee history
1998–2003Based in Essex Junction, VT, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM41998–2003
Locations
LocationPatentsSpan
Essex Junction, VT, US41998–2003