Inventor
JOONGSHIK SHIN
Inventor
KR
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices33%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H10DInorganic electric semiconductor devices18%
G11CStatic stores4%
PatentTitleYear
12,588,516Semiconductor devices and data storage systems including the same202612,501,615Three-dimensional semiconductor memory device and electronic system including vertical structures and seed layer202512,439,600Semiconductor devices and data storage systems including the same202512,310,021Vertical memory device with multiple support layers202512,302,561Semiconductor device, method of manufacturing the same, and massive data storage system including the same202512,289,888Memory device202512,232,323Three-dimensional semiconductor memory devices202512,193,232Semiconductor device including separation patterns and an electronic system202512,165,976Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portions202412,058,859Vertical memory devices having support structures to replace dummy channels and methods of manufacturing the same202412,004,350Three-dimensional semiconductor memory devices202411,980,028Semiconductor device and data storage system including the same202411,877,451Vertical memory devices202411,839,084Three-dimensional semiconductor memory devices having a vertical semiconductor pattern202311,785,768Three-dimensional semiconductor memory devices202311,696,447Semiconductor device and electronic system including the same202311,437,397Three-dimensional semiconductor memory devices202211,430,808Memory device202211,424,259Three-dimensional semiconductor memory devices and methods of fabricating the same202211,387,184Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portions202211,362,105Vertical memory device with support layer202211,348,942Three-dimensional semiconductor memory devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (22)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 22 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 22 | 2022–2026 |