Inventor
Kazuhiro Fuke
Inventor
Osaka, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients11%
C08LCompositions of macromolecular compounds11%
H01LSemiconductor devices11%
C09DCoating compositions, e.g. paints, varnishes or lacquers7%
B41JTypewriters5%
B41MPrinting, duplicating, marking, or copying processes5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
F21VFunctional features or details of lighting devices or systems thereof3%
PatentTitleYear
10,767,068Photocurable inkjet printing ink composition202010,584,253Light-curable inkjet printing ink composition202010,550,275UV-LED curable clear ink composition for ink jet printing202010,543,695Photocurable white ink composition for inkjet printing202010,035,919Photocurable ink composition for inkjet printing20189,450,158'Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition'20169,287,473'Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same'20169,082,940'Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device'20159,029,894'Lead frame for optical semiconductor device and optical semiconductor device using the same'20158,975,101'Element connecting board, producing method thereof, and light emitting diode device'20158,963,180'Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same'20158,907,502'Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device'20148,872,211'Element-connecting board, producing method thereof, and light-emitting diode device'20148,624,343'Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device'20148,466,483'Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device'20138,378,442'Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device'20138,319,228'Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device'20128,017,670'Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same'20117,986,050'Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2016Patents assigned to NITTO DENKO CORP (14)· patent assignee history
2011–2020Based in Osaka, JP· patent location history
2011–2016Based in Ibaraki, JP· patent location history
2012–2015Patents assigned to FUKE KAZUHIRO (6)· patent assignee history
2013–2015Patents assigned to OTA SHINYA (3)· patent assignee history
2014–2015Patents assigned to ONISHI HIDENORI (2)· patent assignee history
2018–2020Patents assigned to SAKATA INX CORP (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 14 | 2011–2016 |
| FUKE KAZUHIROself | 6 | 2012–2015 |
| SAKATA INX CORP | 5 | 2018–2020 |
| OTA SHINYA | 3 | 2013–2015 |
| ONISHI HIDENORI | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 16 | 2011–2020 |
| Ibaraki, JP | 3 | 2011–2016 |