Inventor
ELEANOR PATRICIA PARAS RABADAM
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
G01SRadio direction-finding20%
G02BOptical elements, systems or apparatus10%
H05KPrinted circuits10%
PatentTitleYear
12,581,996Interposer interconnects and enclosure for silicon photonics LIDAR module202612,481,035Silicon photonic systems for LIDAR applications202512,237,300Through-substrate void filling for an integrated circuit assembly202512,165,983Stepped electronic substrate for integrated circuit packages2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to INTEL CORP (4)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2024–2026 |