Inventor

Wei-Yu Chen

Inventor
Taichung, TW

Overview

458→
Patents
1999–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 458 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Bprimary
G02BOptical elements, systems or apparatus23%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H04NPictorial communication, e.g. television6%
G06FElectric digital data processing4%
H04WWireless communication networks3%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
H10DInorganic electric semiconductor devices3%
H05BElectric heating2%
PatentTitleYear
10,879,224Package structure, die and method of manufacturing the same202010,877,777Enabling virtual calls in a SIMD environment202010,868,353Electronic device and manufacturing method thereof202010,854,565Chip package structure with bump202010,852,513Photographing optical lens system, image capturing unit and electronic device202010,839,478Accumulator pooling mechanism202010,840,988Electronic device, method for same and information processing device202010,838,173Photographing lens assembly, imaging apparatus and electronic device202010,840,199Methods of forming connector pad structures, interconnect structures, and structures thereof202010,812,505System and detecting and defending method for edge network202010,811,394Devices employing thermal and mechanical enhanced layers and methods of forming same2020D0898599Device for receiving and transmitting information data and sending out light and sound for warnings202010,796,927Integrated circuit package pad and methods of forming202010,796,667Register spill/fill using shared local memory space202010,795,128Image capturing optical lens assembly, image capturing device and electronic device202010,795,119Imaging optical lens assembly, imaging apparatus and electronic device202010,788,650Optical lens assembly, image capturing apparatus and electronic device202010,790,261Bonding through multi-shot laser reflow202010,782,506Optical imaging lens assembly, image capturing unit and electronic device202010,777,430Photonic integrated package and method forming same202010,769,080Distributed and shared memory controller202010,754,651Register bank conflict reduction for multi-threaded processor202010,756,025Semiconductor package device and method of manufacturing the same202010,750,069Optical image capturing system, image capturing device and electronic device202010,734,357Chip package structure with molding layer202010,720,409Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same202010,721,787Method and apparatus for improving one-to-one sidelink communication in a wireless communication system202010,705,320Lens system, image capturing unit and electronic device202010,707,084Method of manufacturing wafer level chip scale package202010,698,689Recompiling GPU code based on spill/fill instructions and number of stall cycles202010,701,734Method and apparatus of selecting bandwidth part for random access (RA) procedure in a wireless communication system202010,700,900Electronic device, method and computer-readable medium for sensing spectrum usage in a cognitive radio communication system202010,698,179Optical photographing lens assembly, imaging apparatus and electronic device202010,690,886Imaging lens assembly, image capturing unit and electronic device202010,691,430Latency scheduling mehanism202010,693,039Light-emitting element having a reflective structure with high efficiency202010,687,386Method and apparatus of improving connection for sidelink communication in a wireless communication system202010,672,741Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same202010,670,838Image capturing optical lens assembly, image capturing device and electronic device202010,663,693Imaging optical lens assembly, imaging apparatus and electronic device202010,656,386Photographing optical lens system, image capturing apparatus and electronic device202010,656,380Optical imaging lens assembly, image capturing unit and electronic device202010,656,389Imaging optical system, image capturing device and mobile terminal202010,656,385Photographing system, image capturing unit and electronic device202010,658,323Package structure with warpage-control element202010,656,382Imaging lens assembly, image capturing apparatus and electronic device202010,649,179Photographing lens assembly, image capturing unit and electronic device202010,652,996Formable shielding film202010,643,864Fan-out structure and method of fabricating the same202010,636,775Package structure and manufacturing method thereof202010,634,879Image capturing optical lens assembly, image capturing device and electronic device202010,627,605Photographing optical lens assembly, image capturing unit and electronic device202010,613,302Optical photographing lens assembly, image capturing device and electronic device202010,606,039Photographing optical lens assembly, image capturing unit and electronic device202010,606,035Image capturing lens assembly, imaging apparatus and electronic device202010,599,571Instruction prefetch mechanism202010,598,906Optical image lens assembly, image capturing device and electronic device202010,595,167Method and apparatus of handling interest indication in a wireless communication system202010,588,124Method and apparatus for solving mismatch between sidelink buffer status report (BSR) and available sidelink transmission in a wireless communication system202010,578,838Imaging lens system, image capturing unit and electronic device2020D0877196Display screen with a set of icons202010,571,660Imaging lens assembly, imaging apparatus and electronic device202010,564,402Image capturing lens assembly, imaging apparatus and electronic device202010,566,261Integrated fan-out packages with embedded heat dissipation structure202010,555,288Method and apparatus for assisting data transmission in a wireless communication system202010,542,583Method and apparatus of handling sidelink reception in a wireless communication system202010,535,616Warpage control in package-on-package structures202010,536,933Method and apparatus for assisting data transmission in a wireless communication system202010,527,821Imaging optical lens assembly, image capturing unit and electronic device202010,529,650Semiconductor package and method202010,514,528Photographing optical lens system, image capturing unit and electronic device201910,515,915Methods of forming connector pad structures, interconnect structures, and structures thereof201910,512,124Warpage control in the packaging of integrated circuits201910,510,556Integrated circuit package pad and methods of forming201910,504,815Integrated fan-out packages with embedded heat dissipation structure201910,497,661Connecting techniques for stacked CMOS devices201910,488,625Image capturing lens assembly, image capturing device and vehicle photographing terminal201910,481,368Optical lens assembly, image capturing apparatus and electronic device2019D0866591Display screen with a set of icons201910,466,444Optical photographing lens assembly, imaging apparatus and electronic device201910,468,975Flyback converter, active clamp control circuit and active clamp control method201910,453,427Register spill/fill using shared local memory space201910,444,475Optical image lens assembly, image capturing device and electronic device2019D0863354Display screen with icon2019D0863355Display screen with icon201910,433,343Method and apparatus for improving random access procedure in a wireless communication system201910,432,835Optical image capturing system, image capturing device and electronic device201910,429,611Optical photographing lens assembly, imaging apparatus and electronic device201910,416,418Image capturing optical system, image capturing device and electronic device201910,396,597Driving circuit and wireless power transmitter including the same201910,374,642Power line communication method and device201910,361,833Method and apparatus for improving device to device (D2D) communication in a wireless communication system201910,359,607Image capturing lens assembly, imaging apparatus and electronic device201910,356,856Capacitor step-down LED driver and driving method using the same201910,356,758Method and apparatus for requesting and modifying resource configuration in a wireless communication system201910,347,606Devices employing thermal and mechanical enhanced layers and methods of forming same201910,338,355Lens assembly201910,340,155Semiconductor structure and method of forming201910,330,891Optical image lens assembly, image capturing device and electronic device201910,333,351Driving circuit for driving N transmitter-side coupling circuits and wireless power transmitter including the same201910,324,021Magnetophorisis measuring system for determining motion status of object and quantifying amount of magnetic particles contained therein201910,312,572Miniaturized multi-band antenna201910,310,236Photographing optical lens assembly, image capturing unit and electronic device201910,313,140Power distribution unit, power distribution system and network-connecting relay method thereof201910,310,228Optical lens, image capturing device and electronic device201910,302,915Photographing optical lens system, image capturing unit and electronic device201910,297,579Package on-package structure with epoxy flux residue201910,297,471Fan-out structure and method of fabricating the same201910,290,610PoP device and method of forming the same201910,282,227Efficient preemption for graphics processors201910,283,614Semiconductor structure including high electron mobility transistor device201910,283,375Integrated circuit package pad and methods of forming2019D0847843Display screen with graphical user interface2019D0847186Display screen with user interface201910,276,536Structure and formation method of chip package with fan-out structure2019D0847183Display screen with user interface2019D0847184Display screen with user interface2019D0847185Display screen with graphical user interface201910,269,739Methods of forming connector pad structures, interconnect structures, and structures thereof201910,269,926Purging deposition tools to reduce oxygen and moisture in wafers201910,248,180Fast SMP/ASMP mode-switching hardware apparatus for a low-cost low-power high performance multiple processor system201910,247,924Imaging optical lens system, image capturing apparatus and electronic device201910,241,305Image capturing lens assembly, imaging apparatus and electronic device201910,241,303Optical photographing lens assembly, image capturing device and electronic device201910,234,932Method and apparatus for a multiple-processor system201910,237,005Apparatus and method in radio communications system201910,228,535Photographing optical lens assembly, image capturing unit and electronic device201910,222,585Imaging optical system, image capturing device and mobile terminal201910,215,955Photographing optical lens system, imaging apparatus and electronic device201910,199,228Manufacturing method of metal gate structure2019D0839948Camera support201910,191,724Compiler-based instruction scoreboarding201910,191,252Photographing optical lens system, image capturing apparatus and electronic device201910,193,450AC-DC voltage converter with low standby power consumption and control method thereof201910,185,128Optical photographing lens assembly, image capturing unit and electronic device201910,185,125Photographing optical lens system, image capturing unit and electronic device201910,175,456Imaging lens assembly, image capturing apparatus and electronic device201910,175,454Photographing lens assembly, image capturing unit and electronic device201910,171,545System for transferring real-time audio/video stream201910,170,434Warpage control in package-on-package structures201910,163,701Multi-stack package-on-package structures201810,163,803Integrated fan-out packages and methods of forming the same201810,157,862Integrated fan-out package and method of fabricating the same201810,156,702Image lens assembly, imaging apparatus and electronic device201810,154,525Method and apparatus for triggering radio bearer release by a relay UE (user equipment) in a wireless communication system201810,138,215Process for preparing ataluren and its intermediates201810,133,033Optical lens assembly, image capturing apparatus and electronic device201810,134,699Packages with solder ball revealed through layer201810,127,044Bandwidth increase in branch prediction unit and level 1 instruction cache201810,107,991Image capturing optical lens assembly, image capturing device and electronic device201810,109,607Under bump metallurgy (UBM) and methods of forming same2018D0830392Display screen or portion thereof with graphical user interface201810,090,284Semiconductor device and method of manufacture2018D0829227Display screen or portion thereof with graphical user interface201810,082,645Image capturing optical system, image capturing device and electronic device201810,082,646Photographing optical lens system, image capturing apparatus and electronic device201810,083,927Chip package structure with bump201810,073,243Optical lens system, imaging device and electronic device201810,073,248Imaging lens system, image capturing apparatus and electronic device201810,073,251Imaging optical lens system, image capturing apparatus and electronic device201810,073,247Image capturing optical lens assembly, image capturing device and electronic device201810,068,854Semiconductor package device and method of manufacturing the same201810,064,065Downlink direction remote radio unit selection decision method and apparatus201810,054,765Photographing optical lens assembly, imaging device and electronic device201810,048,471Photographing system, image capturing unit and electronic device201810,042,350System and method for detecting printing filament for three dimensional printing201810,045,232Electronic device, method and computer-readable medium for sensing spectrum usage in a cognitive radio communication system201810,042,143Image capturing lens system, image capturing apparatus and electronic device201810,036,876Photographing optical lens system, image capturing unit and electronic device201810,036,873Optical imaging lens, image capturing apparatus and electronic device201810,031,318Optical imaging lens assembly, image capturing unit and electronic device201810,025,072Imaging lens assembly, image capturing unit and electronic device201810,014,441Light-emitting device201810,007,086Image capturing optical lens assembly, image capturing device and electronic device201810,007,095Lens system, image capturing unit and electronic device201810,007,093Imaging lens assembly, image capturing apparatus and electronic device20189,998,308Electronic device, method and computer-readable medium for sensing spectrum usage in a cognitive radio communication system20189,989,741Photographing optical lens assembly, image capturing unit and electronic device20189,984,998Devices employing thermal and mechanical enhanced layers and methods of forming same20189,977,222Optical imaging lens assembly, image capturing unit and electronic device20189,977,225Photographing optical lens assembly, image capturing unit and electronic device20189,979,301Control method and control circuit for switching power supply20189,958,645Photographing optical lens assembly, image capturing unit and electronic device20189,961,244Optical image capturing system, image capturing device and electronic device20189,953,963Integrated circuit process having alignment marks for underfill20189,952,412Imaging lens system, image capturing unit and electronic device20189,952,650Hardware apparatus and method for multiple processors dynamic asymmetric and symmetric mode switching20189,941,248Package structures, pop devices and methods of forming the same20189,941,221Warpage control in package-on-package structures20189,935,067Methods of forming connector pad structures, interconnect structures, and structures thereof20189,935,044Semiconductor packaging and manufacturing method thereof20189,929,071'Dicing in wafer level package'20189,922,938'Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same'20189,924,569'LED driving circuit'20189,922,939'Wafer level shielding in multi-stacked fan out packages and methods of forming same'20189,904,038'Photographing system, image capturing unit and electronic device'20189,905,910'Electronic device and multi-band antenna'20189,907,130'High-efficiency LED driver and driving method'20189,905,911'Antenna for electronic device'20189,897,785'Image capturing lens assembly, image capturing device and vehicle photographing terminal'20189,886,734'Techniques for graphics data prefetching'20189,888,509'Method and apparatus for performing a random access (RA) procedure for device to-device (D2D) service in a wireless communication system'20189,885,855'Photographing optical lens system, image capturing unit and electronic device'20189,888,527'Systems for processing semiconductor devices, and methods of processing semiconductor devices'20189,880,839'Instruction that performs a scatter write'20189,882,002'FinFET with an asymmetric source/drain structure and method of making same'20189,880,373'Imaging optical lens assembly, image capturing unit and electronic device'20189,881,903'Package-on-package structure with epoxy flux residue'20189,874,720Imaging system, image capturing apparatus and electronic device20189,871,441'Current feedback method, current feedback circuit, driving circuit and switching power supply thereof'20189,859,258'Semiconductor device and method of manufacture'20189,857,563'Optical image system, image capturing device and electronic device'20189,859,245'Chip package structure with bump and method for forming the same'20189,853,008Connecting techniques for stacked CMOS devices20179,837,278Wafer level chip scale package and method of manufacturing the same20179,831,215Semiconductor package and forming method thereof20179,825,007'Chip package structure with molding layer and method for forming the same'20179,810,880'Imaging optical system, image capturing apparatus and electronic device'20179,812,337'Integrated circuit package pad and methods of forming'20179,806,059'Multi-stack package-on-package structures'20179,791,666'Imaging optical system, image capturing apparatus and electronic device'20179,791,670'Optical lens, image capturing device and electronic device'20179,793,231'Under bump metallurgy (UBM) and methods of forming same'20179,766,892'Method and apparatus for efficient execution of nested branches on a graphics processor unit'20179,766,433'Photographing optical lens assembly, image capturing unit and electronic device'20179,768,136'Interconnect structure and method of fabricating same'20179,761,551'Solder joint structure for ball grid array in wafer level package'20179,759,892'Imaging optical lens assembly, image capturing apparatus and electronic device'20179,756,688'High efficiency LED drivers with high power factor'20179,742,509'Apparatus and method in radio communications system'20179,733,455'Optical image lens assembly, image capturing device and electronic device'20179,729,068'Switching mode converter'20179,726,857'Optical photographing lens assembly, image capturing device and electronic device'20179,717,092'Method and apparatus for allocating resources for device-to-device (D2D) communication in a wireless communication system'20179,717,133'Wireless LED driver'20179,706,093'Photographing system, image capturing unit and electronic device'20179,702,750'Material level indicator'20179,696,522'Photographing optical lens assembly, image capturing device and electronic device'20179,685,588'Light-emitting element having a reflective structure with high efficiency'20179,678,315'Photographing optical lens system, image capturing unit and electronic device'20179,671,591'Optical lens assembly, image capturing apparatus and electronic device'20179,673,182'Package on package bonding structure and method for forming the same'20179,671,588'Image capturing optical lens assembly, image capturing device and electronic device'20179,667,847'Photographing optical lens assembly, imaging device and electronic device'20179,659,878'Wafer level shielding in multi-stacked fan out packages and methods of forming same'20179,653,300'Structure of metal gate structure and manufacturing method of the same'20179,653,393'Method and layout of an integrated circuit'20179,645,363'Image capturing optical system, image capturing device and electronic device'20179,641,084'Control method and control circuit for switching power supply'20179,638,894'Photographing optical lens assembly, image capturing device and electronic device'20179,640,496'Semiconductor device'20179,627,288'Package structures and methods of forming the same'20179,625,680'Optical photographing lens assembly, image capturing apparatus and electronic device'20179,627,992'Controlling circuit and AC/DC converter thereof'20179,621,068'Load driving circuit and method thereof'20179,606,328'Photographing optical lens assembly, image capturing unit and electronic device'20179,606,327'Lens system, image capturing unit and electronic device'20179,608,605'Apparatus and scheme for IO-pin-less calibration or trimming of on-chip regulators'20179,602,731'Image capturing lens assembly, image capturing device and vehicle photographing terminal'20179,588,318'Image capturing optical system, image capturing device and portable device'20179,588,321'Imaging lens system, image capturing unit and electronic device'20179,576,888'Package on-package joint structure with molding open bumps'20179,577,332'Electronic device and multi-band antenna'20179,570,413'Packages with solder ball revealed through laser'20179,570,410'Methods of forming connector pad structures, interconnect structures, and structures thereof'20179,559,064'Warpage control in package-on-package structures'20179,557,534'Photographing optical lens assembly, image capturing unit and electronic device'20179,558,996'Method for filling trench with metal layer and semiconductor structure formed by using the same'20179,557,530'Photographing optical lens assembly, image capturing unit and mobile device'20179,557,535'Photographing optical system, image capturing device and electronic device'20179,543,828'Low-noise multi-output power supply circuit and control method thereof'20179,538,582'Warpage control in the packaging of integrated circuits'20179,536,865'Interconnection joints having variable volumes in package structures and methods of formation thereof'20179,538,330'System and method for selecting a Wi-Fi access point for position determination'20179,525,344'Constant time controller and controlling method for a switching regulator'20169,525,357'Control and drive circuit and method'20169,523,841'Photographing optical lens system, image capturing unit and electronic device'20169,519,467'Efficient and consistent software transactional memory'20169,507,126'Optical imaging system, image capturing unit and electronic device'20169,488,807'Optical imaging lens assembly, image capturing unit and electronic device'20169,484,227'Dicing in wafer level package'20169,482,844'Imaging lens system, image capturing device and electronic device'20169,477,064'Image capturing apparatus'20169,461,001'Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same'20169,449,934'Solder joint structure for ball grid array in wafer level package'20169,444,445'Power switch driving circuits and power converters thereof'20169,443,758'Connecting techniques for stacked CMOS devices'20169,442,276'Photographing optical lens system'20169,445,287'Electronic device, method and computer-readable medium for sensing spectrum usage in a cognitive radio communication system'20169,438,118'Efficient boost-buck converter and control method thereof'20169,438,108'Bias voltage generating circuit and switching power supply thereof'20169,435,985'Optical imaging system, image capturing unit and electronic device'20169,429,735'Optical lens system, image capturing unit and electronic device'2016D0764449'Phone case'20169,418,955'Plasma treatment for semiconductor devices'20169,417,438'Photographing lens system, image capturing device and electronic device'2016D0763239'Phone case'20169,411,134'Optical imaging lens assembly, image capturing unit and electronic device'20169,400,304'Method and apparatus for testing the excitation characteristic of current transformer'20169,397,062'Package on package bonding structure and method for forming the same'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2020Based in Taipei, TW· patent location history
2010–2020Based in Hsinchu, TW· patent location history
2011–2017Patents assigned to CHEN WEI-YU (36)· patent assignee history
2011–2020Patents assigned to INTEL CORP (19)· patent assignee history
2013–2020Patents assigned to LARGAN PRECISION CO LTD (187)· patent assignee history
2013–2020Based in Taichung, TW· patent location history
2013–2020Based in New Taipei, TW· patent location history
2015–2019Patents assigned to SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD (35)· patent assignee history
2015–2019Based in Saratoga, CA, US· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (76)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LARGAN PRECISION CO LTD1872013–2020
TAIWAN SEMICONDUCTOR MFG CO LTD762016–2020
CHEN WEI-YUself362011–2017
SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD352015–2019
INTEL CORP192011–2020
Locations
LocationPatentsSpan
Taichung, TW1862013–2020
Taipei, TW772009–2020
New Taipei, TW432013–2020
Saratoga, California, US312015–2019
Hsinchu, TW232010–2020