Inventor
Seung Ho Ahn
Inventor
Daejeon, KR
Overview
Patents· 40 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Mprimary
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy18%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution18%
G02BOptical elements, systems or apparatus15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y02PClimate change mitigation technologies in the production or processing of goods6%
H05KPrinted circuits3%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles2%
B60LPropulsion of electrically-propelled vehicles2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H01RElectrically-conductive connections2%
PatentTitleYear
10,734,632Pouch type secondary battery and method of manufacturing the same202010,340,500Pouch battery having improved overcharging safety201910,320,037Overcharge safety device201910,224,534Swelling current interrupt device201910,193,189Battery cell201910,147,916Battery cell201810,109,842Battery cell201810,059,217System and method for controlling battery switching serial/parallel connection of battery modules due to accelerator operation20189,825,278'High voltage battery for vehicles'20179,741,995'Battery system improving operation reliability of swelling CID'20179,472,801'Battery overcharge protection device'20169,452,939'High-capacity anode material for lithium secondary batteries and process for synthesizing the same'20169,431,647'Secondary battery having a safety device'20169,324,991'High voltage battery for vehicles'20168,715,539'Positive electrode material for lithium secondary battery and method for manufacturing the same'20148,372,475'Method for preparing cross-linked ceramic-coated separator containing ionic polymer, ceramic-coated separator prepared by the method, and lithium secondary battery using the same'20137,843,126'Color filter panel, organic light emitting display apparatus and method of manufacturing the same'20107,478,954'Structure and method for optical connection between optical transmitter and optical receiver'20097,460,760'Optical waveguide master and method of manufacturing the same'20087,276,918'Sensor and apparatus for measuring the flow electric potential'20077,241,040'Backlight assembly and liquid crystal display apparatus having the same'20077,220,065'Connection apparatus for parallel optical interconnect module and parallel optical interconnect module using the same'20077,149,389'Optical printed circuit board system having tapered waveguide'20067,031,584'Method for manufacturing optical waveguide using laser direct writing method and optical waveguide manufactured by using the same'20066,955,564'Differential pair interconnection apparatus'20056,912,332'Parallel optical interconnection module and method for manufacturing the same'20056,877,912'Electro-optical circuit board having optical transmit/receive module and optical waveguide'20056,213,817'Compliant press-fit pin having compliant cantilever beam'20016,129,865'Manufacturing method of multifiber connector ferrule for ribbon-type optical cable'20005,983,702'Compound testing machine for testing various mechanical properties used for optical connector'19995,897,339'Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same'19995,799,122'Multifiber optical connector'19985,744,827'Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements'19985,727,102'Multifiber optical connector for optical ribbon cable'19985,677,569'Semiconductor multi-package stack'19975,625,221'Semiconductor assembly for a three-dimensional integrated circuit package'19975,621,242'Semiconductor package having support film formed on inner leads'19975,552,635'High thermal emissive semiconductor device package'19965,504,373'Semiconductor memory module'19965,351,334'Rotation and alignment device for assembling of optical fiber connector with lower connection loss'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2009Patents assigned to KOREA ELECTRONICS TELECOMM (14)· patent assignee history
1994–2000Patents assigned to KOREA TELECOMMUNICATION (4)· patent assignee history
1994–2009Based in Daejeon, KR· patent location history
1996–2010Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
1996–2007Based in Suwon-si, KR· patent location history
2007–2020Patents assigned to HYUNDAI MOTOR CO LTD (17)· patent assignee history
2010–2019Based in Gyeonggi-do, KR· patent location history
2013–2016Patents assigned to AHN SEUNG HO (3)· patent assignee history
2014–2017Based in Seoul, KR· patent location history
2018–2020Based in Hanam-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HYUNDAI MOTOR CO LTD | 17 | 2007–2020 |
| KOREA ELECTRONICS TELECOMM | 14 | 1994–2009 |
| SAMSUNG ELECTRONICS CO LTD | 9 | 1996–2010 |
| KOREA TELECOMMUNICATION | 4 | 1994–2000 |
| AHN SEUNG HOself | 3 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Daejeon, KR | 9 | 1994–2009 |
| Suwon-si, KR | 7 | 1996–2007 |
| Gyeonggi-do, KR | 6 | 2010–2019 |
| Hanam-si, KR | 5 | 2018–2020 |
| Seoul, KR | 5 | 2014–2017 |