LexDanaLexDanabeta
Inventor

Kishio Yokouchi

Inventor
Kawasaki, JP

Overview

51→
Patents
1982–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits15%
G02BOptical elements, systems or apparatus13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y10TTechnical subjects covered by former us classification9%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
C08LCompositions of macromolecular compounds5%
C03CChemical composition of glasses, glazes or vitreous enamels3%
PatentTitleYear
8,186,053'Circuit board and method of manufacturing the same'20128,161,636'Circuit board and method of manufacturing the same'20127,999,193'Wiring substrate and method of manufacturing the same'20117,504,014'High density interconnections with nanowiring'20097,489,842'Attachment-type optical coupler apparatuses'20097,453,058'Optical bumps for low-loss interconnection between a device and its supported substrate and related methods'20087,418,165'Flexible optical waveguides for backplane optical interconnections'20087,376,295'Opto-electronic processors with reconfigurable chip-to-chip optical interconnections'20087,329,481'Substrate optical waveguides having fiber-like shape and methods of making the same'20087,283,220'Methods and apparatuses for measuring the refractive index and other optical properties of liquids, gels, and solids'20077,277,611'Optical interconnect platform including Bragg diffractive gratings in a bulk material'20077,257,295'Attachment-type optical coupler apparatuses'20077,229,219'Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection'20077,224,881'Variable optical attenuator'20077,209,621'Optical apparatuses providing optical interconnections among a plurality of electronic components'20077,206,472'Optical backplanes with integrated optical couplers and methods of making the same'20077,171,083'One-by-N optical switch'20077,171,065'Compact optical devices and methods for making the same'20077,092,603'Optical bridge for chip-to-board interconnection and methods of fabrication'20067,083,869'Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions'20067,072,117'Micro-lens array'20067,043,132'Variable optical attenuator having a waveguide and an optically coupled layer with a power monitor'20067,035,524'Variable optical attenuator'20066,999,238'Tunable micro-lens array'20066,996,303'Flexible optical waveguides for backplane optical interconnections'20066,865,310'Multi-layer thin film optical waveguide switch'20056,743,851'Polyimide film'20046,734,248'Pattern forming process using polyimide resin composition'20046,504,966'Optical deflecting element, optical switch module, light signal switching device'20036,403,289'Developer for photosensitive polyimide resin composition'20026,310,135'Polyimide resin composition'20016,193,905'Immersion cooling coolant'20016,160,081'Photosensitive polyimide resin composition'20006,001,488'Composition of epoxy group-containing cycloolefin resin'19995,895,800'Composition of epoxy group-containing cycloolefin resin'19995,886,136'Pattern forming process'19995,783,639'Composition of epoxy group-containing cycloolefin resin'19985,777,068'Photosensitive polyimide resin composition'19985,593,526'Process for preparing a multi-layer wiring board'19975,534,331'Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant'19965,478,972'Multilayer circuit board and a method for fabricating the same'19955,458,709'Process for manufacturing multi-layer glass ceramic substrate'19955,349,499'Immersion cooling coolant and electronic device using this coolant'19945,324,370'Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant'19945,275,889'Multi-layer wiring board'19945,196,384'Method for preparing green sheets'19935,038,571'Production and use of coolant in cryogenic devices'19914,761,325'Multilayer ceramic circuit board'19884,704,658'Evaporation cooling module for semiconductor devices'19874,642,148'Method for producing a multilayer ceramic circuit board'19874,346,516'Method of forming a ceramic circuit substrate'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–2012Patents assigned to FUJITSU LTD (51)· patent assignee history
1987–1991Based in Zama, JP· patent location history
1993–2012Based in Kawasaki, JP· patent location history
1998–2004Patents assigned to NIPPON ZEON CO (9)· patent assignee history
1998–2007Based in Kanagawa, JP· patent location history
2005–2008Based in San Jose, CA, US· patent location history
2007–2009Based in Tokyo, JP· patent location history
2011–2012Patents assigned to SHINKO ELECTRIC IND CO (3)· patent assignee history
2012Patents assigned to FUKASE KATSUYA (2)· patent assignee history
2012Patents assigned to YOKOUCHI KISHIO (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD511982–2012
NIPPON ZEON CO91998–2004
SHINKO ELECTRIC IND CO32011–2012
FUKASE KATSUYA22012
YOKOUCHI KISHIOself22012
Locations
LocationPatentsSpan
Kawasaki, JP151993–2012
San Jose, California, US132005–2008
Tokyo, JP82007–2009
Kanagawa, JP81998–2007
Zama, JP41987–1991