Inventor
Kathleen A. Lidestri
Inventor
Hopewell Junction, NY, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering40%
H05KPrinted circuits27%
B22FWorking metallic powder13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
6,070,782'Socketable bump grid array shaped-solder on copper spheres'20005,868,304'Socketable bump grid array shaped-solder on copper spheres'19995,779,133'In-situ device removal for multi-chip modules'19985,605,277'Hot vacuum device removal process and apparatus'19975,553,766'In-situ device removal for multi-chip modules'19965,284,286'Porous metal block for removing solder or braze from a substate and a process for making the same'19945,219,520'Process of making a porous metal block for removing solder or braze'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2000Patents assigned to IBM (7)· patent assignee history
1993–2000Based in Hopewell Junction, NY, US· patent location history
1997Based in Dutchess County, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 7 | 1993–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 6 | 1993–2000 |
| Dutchess County, New York, US | 1 | 1997 |