Inventor
Vinh H. Diep
Inventor
Palo Alto, CA, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing23%
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification10%
H01LSemiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
A45CPurses6%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
G11BInformation storage based on relative movement between record carrier and transducer4%
LOC144%
PatentTitleYear
10,963,024Combination parallel path heatsink and EMI shield202110,653,034Thermal flow assembly including integrated fan202010,591,956Foldable case for use with an electronic device2020D0859385Picture frame smartphone case2019D0858500Picture frame smartphone case201910,285,303Electronic device with integrated passive and active cooling201910,061,363Combination parallel path heatsink and EMI shield201810,034,411Thermal flow assembly including integrated fan20189,760,118'Foldable case for use with an electronic device'20179,612,632'Wireless electronic device with component cooling structures'20179,408,334'Electronic device with component shielding structures and input-output connectors'20169,095,076'Electronic device enclosures and heatsink structures with thermal management features'20159,048,124'Heat sinking and electromagnetic shielding structures'20158,760,868'Electronic device enclosures and heatsink structures with thermal management features'20148,672,126'Foldable case for use with an electronic device'20148,493,740'Component retention mechanism'20137,995,350'Component retention mechanism'20117,539,015'Riser card housing'20096,041,121'Handset access mechanism and method'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2017Based in Milpitas, CA, US· patent location history
2009–2021Patents assigned to APPLE INC (16)· patent assignee history
2013–2015Patents assigned to DIEP VINH H (2)· patent assignee history
2014Patents assigned to DIEP Vinh (2)· patent assignee history
2014–2015Patents assigned to GOH CHIEW-SIANG (2)· patent assignee history
2014–2021Based in Palo Alto, CA, US· patent location history
2019Patents assigned to BBY SOLUTIONS INC (2)· patent assignee history
2019Based in Santa Monica, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLE INC | 16 | 2009–2021 |
| BBY SOLUTIONS INC | 2 | 2019 |
| DIEP VINH Hself | 2 | 2013–2015 |
| DIEP Vinhself | 2 | 2014 |
| GOH CHIEW-SIANG | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palo Alto, California, US | 10 | 2014–2021 |
| Milpitas, California, US | 7 | 2000–2017 |
| Santa Monica, California, US | 2 | 2019 |