Inventor

Shigeru Tago

Inventor

Nagaokakyo, JP

Overview

1999–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits30%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

H01PWaveguides15%

H01LSemiconductor devices8%

H03HImpedance networks, e.g. resonant circuits8%

H04BTransmission7%

G06FElectric digital data processing2%

H04NPictorial communication, e.g. television2%

H01RElectrically-conductive connections2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

PatentTitleYear

10,455,706Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate2019 10,338,031Component-embedded substrate and substrate flaw detecting method2019 10,278,289Resin circuit board and resin circuit board having component mounted thereon2019 10,231,342Component built-in substrate2019 10,219,367Multilayer resin substrate, and method of manufacturing multilayer resin substrate2019 10,166,747Resin multilayer substrate and method of manufacturing the same2019 10,158,157High-frequency signal line and manufacturing method thereof2018 10,028,388Component-embedded substrate2018 9,986,139Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same2018 9,974,185Component-embedded substrate2018 9,961,780Method for manufacturing resin multilayer board2018 9,922,918'Substrate for stacked module, stacked module, and method for manufacturing stacked module'2018 9,882,256'High-frequency signal transmission line and electronic apparatus'2018 9,854,663Radio frequency module2017 9,854,677Module component2017 9,848,489Multilayer resin substrate, and method of manufacturing multilayer resin substrate2017 9,813,595'Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same'2017 9,774,070'High-frequency signal line and manufacturing method thereof'2017 9,743,507'Radio frequency module'2017 9,730,322'Production method of component-embedded substrate, and component-embedded substrate'2017 9,673,502'High-frequency signal transmission line and electronic device'2017 9,666,925'Transmission line, a transmission line apparatus, and an electronic device'2017 9,629,249'Component-embedded substrate and communication module'2017 9,565,346'Camera module'2017 9,490,513'High-frequency signal transmission line and electronic device'2016 9,462,678'High-frequency signal transmission line and electronic device'2016 9,414,482'High-frequency signal transmission line and electronic apparatus'2016 9,401,532'High-frequency signal line and electronic device including the same'2016 9,401,531'High-frequency signal transmission line and electronic device'2016 9,401,534'High-frequency signal line and electronic device'2016 9,252,132'Semiconductor device and semiconductor module'2016 9,185,795'High-frequency signal transmission line'2015 9,084,365'Electronic module'2015 9,059,493'High-frequency signal line and electronic device'2015 9,007,151'High-frequency signal transmission line and electronic apparatus'2015 8,937,257'Electronic module'2015 8,659,370'High-frequency signal transmission line and electronic apparatus'2014 8,653,910'High-frequency signal transmission line and electronic apparatus'2014 8,624,692'High-frequency signal transmission line'2014 8,525,613'High-frequency signal transmission line and electronic apparatus'2013 7,421,424'Database search information output method'2008 7,191,173'Method of determining database search path'2007 5,864,829'Network charge method and system'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2008Patents assigned to HITACHI SOFTWARE ENG (3)· patent assignee history

1999Based in Yokohama, JP· patent location history

2007–2008Based in Tokyo, JP· patent location history

2013–2019Patents assigned to MURATA MANUFACTURING CO (40)· patent assignee history

2013–2019Based in Nagaokakyo, JP· patent location history

2017–2018Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MURATA MANUFACTURING CO	40	2013–2019
HITACHI SOFTWARE ENG	3	1999–2008

Locations

Location	Patents	Span
Nagaokakyo, JP	37	2013–2019
Kyoto, JP	3	2017–2018
Tokyo, JP	2	2007–2008
Yokohama, JP	1	1999