Inventor

Takuya Kadoguchi

Inventor

Toyota, JP

Overview

2014–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%

H01LSemiconductor devices39%

B23KSoldering or unsoldering3%

C22CAlloys3%

H10DInorganic electric semiconductor devices3%

C23CCoating metallic material1%

C25DProcesses for the electrolytic or electrophoretic production of coatings1%

G01NInvestigating or analysing materials by determining their chemical or physical properties1%

H01RElectrically-conductive connections1%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems1%

PatentTitleYear

10,950,526Semiconductor device2021 10,546,760Method of manufacturing semiconductor device2020 10,475,727Semiconductor device, manufacturing method for semiconductor device, and electrode plate2019 10,396,008Semiconductor device2019 10,312,211Method of manufacturing semiconductor device2019 10,103,091Semiconductor device2018 10,103,090Semiconductor device2018 10,049,952Method of fabricating a semiconductor module with a inclined groove formed in resin side surface2018 9,960,096Semiconductor device2018 9,953,905Semiconductor device2018 9,847,311Semiconductor device and manufacturing method for the semiconductor device2017 9,831,160Semiconductor device2017 9,824,961'Semiconductor device'2017 9,824,994'Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device'2017 9,711,884'Terminal connection structure and semiconductor apparatus'2017 9,659,892'Semiconductor device and method of manufacturing semiconductor device'2017 9,502,326'Semiconductor device'2016 9,466,549'Semiconductor module'2016 9,406,593'Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus'2016 9,331,001'Semiconductor module'2016 9,312,211'Semiconductor device and manufacturing method thereof'2016 9,236,330'Power module'2016 9,224,663'Semiconductor device'2015 9,224,662'Semiconductor apparatus'2015 9,165,848'Semiconductor device'2015 9,059,145'Power module, method for manufacturing power module, and molding die'2015 9,006,784'Semiconductor device and manufacturing method thereof'2015 8,994,167'Semiconductor device'2015 8,884,411'Semiconductor device and manufacturing method thereof'2014 8,878,347'Power module'2014 8,810,026'Semiconductor module'2014 8,742,556'Semiconductor module'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2020Patents assigned to TOYOTA MOTOR CO LTD (31)· patent assignee history

2014–2016Patents assigned to KADOGUCHI TAKUYA (13)· patent assignee history

2014–2021Patents assigned to DENSO CORP (11)· patent assignee history

2014–2016Patents assigned to OKUMURA TOMOMI (10)· patent assignee history

2014–2016Patents assigned to KAWASHIMA TAKANORI (6)· patent assignee history

2014–2021Based in Toyota, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOYOTA MOTOR CO LTD	31	2014–2020
KADOGUCHI TAKUYAself	13	2014–2016
DENSO CORP	11	2014–2021
OKUMURA TOMOMI	10	2014–2016
KAWASHIMA TAKANORI	6	2014–2016

Locations

Location	Patents	Span
Toyota, JP	32	2014–2021