Inventor
EN-CIH YANG
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing67%
G06NComputing arrangements based on specific computational models33%
PatentTitleYear
12,307,184Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning202512,242,781Systems and methods for machine learning based fast static thermal solver202511,914,931Predicting on chip transient thermal response in a multi-chip system using an RNN-based predictor202411,853,661Systems and methods for machine learning based fast static thermal solver202311,797,744Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning202311,366,947Systems and methods for machine learning based fast static thermal solver2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ANSYS INC (6)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ANSYS INC | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2025 |