Inventor
TAKAAKI TSUNOMURA
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G11CStatic stores5%
H10BElectronic memory devices5%
H10NElectric solid-state devices not otherwise provided for5%
PatentTitleYear
12,261,205Semiconductor device202512,080,716Method of manufacturing semiconductor device202411,996,448Manufacturing method of semiconductor device including field-effect transistor comprising buried oxide (BOX) film and silicon layer202411,700,778Method for controlling the forming voltage in resistive random access memory devices202311,695,012Semiconductor device and manufacturing method of the same202311,658,211Semiconductor device and manufacturing method of the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to RENESAS ELECTRONICS CORP (5)· patent assignee history
2023Patents assigned to IBM (1)· patent assignee history
2023Patents assigned to TOKYO ELECTRON LTD (1)· patent assignee history
2023–2025Based in JP· patent location history
2023Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 5 | 2023–2025 |
| IBM | 1 | 2023 |
| TOKYO ELECTRON LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2023–2025 |
| US | 1 | 2023 |