Inventor

JIUN YI WU

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 130 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

H01LSemiconductor devices31%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%

H05KPrinted circuits5%

G02BOptical elements, systems or apparatus3%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%

Y10TTechnical subjects covered by former us classification1%

H10DInorganic electric semiconductor devices1%

H01PWaveguides1%

H10BElectronic memory devices1%

PatentTitleYear

12,554,080Optical connection structures for a photonic assembly and methods for forming the same2026 12,550,734Integrated circuit package and method2026 12,532,755Semiconductor device and method of manufacturing2026 12,476,135Semiconductor package and method2025 12,469,756Warpage control of packages using embedded core frame2025 12,469,812Method for manufacturing semiconductor package with connection structures including via groups2025 12,451,366Semiconductor package and method of forming thereof2025 12,442,978Photonic package and method of manufacture2025 12,424,562Three-dimensional (3D) package2025 12,417,969Semiconductor structure and circuit structure2025 12,411,279Integrated circuit package and method of forming same2025 12,412,862Package structure and manufacturing method thereof2025 12,401,012Semiconductor device package and methods of manufacture2025 12,394,732Semiconductor package and method2025 12,368,146Hybrid integrated circuit packages2025 12,368,077Semiconductor package and method comprising formation of redistribution structure and interconnecting die2025 12,362,228Semiconductor package and method2025 12,356,558Electronic assembly having circuit carrier2025 12,354,924Integrated circuit package and method2025 12,354,969Semiconductor device and method of manufacture2025 12,347,802Die corner removal for underfill crack suppression in semiconductor die packaging2025 12,334,446Semiconductor package and method2025 12,334,362Package structure including photonic package having embedded optical glue2025 12,308,343Semiconductor device and method of forming the same2025 12,300,656Semiconductor package and method of forming thereof2025 12,272,631Semiconductor package having multiple substrates2025 12,272,855Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials2025 12,249,564Package structure, RDL structure comprising redistribution layer having ground plates and signal lines2025 12,249,518Semiconductor device comprising interconnect structures2025 12,249,587Semiconductor structure and forming method thereof2025 12,243,829Semiconductor package including cavity-mounted device2025 12,245,361Interconnect structure having conductor extending along dielectric block2025 12,243,843Integrated circuit package and method of forming same2025 12,228,776Package with integrated optical die and method forming same2025 12,230,589Semiconductor package2025 12,218,021Semiconductor packages and methods of forming the same2025 12,217,976Method of fabricating package2025 12,218,020Semiconductor packages2025 12,211,779Semiconductor package having multiple substrates2025 12,205,879Symmetrical substrate for semiconductor packaging2025 12,199,080Electronics card including multi-chip module2025 12,191,251Semiconductor device and method of manufacture2025 12,193,168Circuit board and semiconductor device including the same2025 12,183,682Semiconductor package and manufacturing method thereof2024 12,183,700Semiconductor device package and method of manufacture2024 12,170,267Semiconductor device and method of manufacture2024 12,165,941Semiconductor device and method of manufacture2024 12,159,822Method of manufacturing a semiconductor package having conductive pillars2024 12,142,560Semiconductor packages and methods of forming same2024 12,119,292Semiconductor device and method of manufacture2024 12,100,672Semiconductor device and method of manufacture2024 12,080,563Semiconductor devices and methods of manufacturing2024 12,074,122Inductor structure, semiconductor package and fabrication method thereof2024 12,068,297Hybrid integrated circuit package2024 12,062,619Semiconductor packages and forming methods thereof2024 12,062,604Semiconductor structure and manufacturing method thereof2024 12,057,410Semiconductor device and method of manufacture2024 12,051,650Semiconductor package and method2024 12,038,599Photonic package and method of manufacture2024 12,040,281Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof2024 12,021,053Semiconductor package and method2024 12,002,767Integrated circuit package and method2024 11,984,375Integrated circuit package and method2024 11,984,374Warpage control of packages using embedded core frame2024 11,961,814Integrated circuit package and method2024 11,955,442Semiconductor package and method2024 11,935,761Semiconductor package and method of forming thereof2024 11,894,318Semiconductor device and method of manufacture2024 11,894,312Semiconductor packages and method of manufacture2024 11,855,057Package structure and method of forming the same2023 11,854,988Semiconductor device and method of manufacture2023 11,848,304Semiconductor device and method of forming the same2023 11,848,234Semiconductor package and method comprising formation of redistribution structure and interconnecting die2023 11,837,567Semiconductor package and method of forming thereof2023 11,830,797Semiconductor device and method of manufacture2023 11,824,032Die corner removal for underfill crack suppression in semiconductor die packaging2023 11,817,380Semiconductor package and method of forming same2023 11,817,325Methods of manufacturing a semiconductor package2023 11,810,847Package structure and method of fabricating the same2023 11,791,275Semiconductor device and method of manufacturing2023 11,784,140Semiconductor device and method of manufacture2023 11,776,886Symmetrical substrate for semiconductor packaging2023 11,756,945Semiconductor device package and methods of manufacture2023 11,756,801Stencil structure and method of fabricating package2023 11,749,594Semiconductor structure and manufacturing method thereof2023 11,737,205Interconnect structure having conductor extending along dielectric block2023 11,728,217Wafer level package structure and method of forming same2023 11,715,686Semiconductor device and method of manufacture2023 11,705,378Semiconductor packages and methods of forming the same2023 11,705,408Semiconductor package2023 11,699,691Interposer frame and method of manufacturing the same2023 11,688,693Semiconductor packages and method of manufacture2023 11,670,575Package structure, RDL structure comprising redistribution layer having ground plates and signal lines2023 11,664,566Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines2023 11,665,834Electronic assembly having circuit carrier and manufacturing method thereof2023 11,664,350Semiconductor device and method of manufacture2023 11,658,085Integrated circuit package and method2023 11,658,164Electronics card including multi-chip module2023 11,658,134Inductor structure, semiconductor package and fabrication method thereof2023 11,616,026Semiconductor device and method of manufacture2023 11,605,621Hybrid integrated circuit package and method2023 11,602,056Circuit board and semiconductor device including the same2023 11,594,498Semiconductor package and method2023 11,594,479Semiconductor structure and manufacturing method thereof2023 11,532,582Semiconductor device package and method of manufacture2022 11,532,587Method for manufacturing semiconductor package with connection structures including via groups2022 11,515,173Semiconductor devices and methods of manufacturing2022 11,488,881Semiconductor device and method of manufacture2022 11,482,484Symmetrical substrate for semiconductor packaging2022 11,457,525Interconnect structure having conductor extending along dielectric block2022 11,410,968Semiconductor device and method of forming the same2022 11,398,422Package structure and fabricating method thereof2022 11,380,620Semiconductor package including cavity-mounted device2022 11,355,463Semiconductor package and method2022 11,355,428Semiconductor package2022 11,348,874Semiconductor packages and forming methods thereof2022 11,315,862Semiconductor structure and manufacturing method thereof2022 11,282,779Package structure and fabricating method thereof2022 11,282,761Semiconductor packages and methods of manufacturing the same2022 11,270,990Contoured package-on-package joint2022 11,258,151Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material2022 11,251,099Warpage control of packages using embedded core frame2022 11,239,193Integrated circuit package and method2022 11,217,546Embedded voltage regulator structure and method forming same2022 11,217,497Integrated circuit package and method2022 11,217,538Integrated circuit package and method2022 11,195,788Hybrid dielectric scheme in packages2021 11,177,218Package including metallic bolstering pattern and manufacturing method of the package2021 11,152,344Integrated circuit package and methods of forming same2021 11,145,614Semiconductor device and method of manufacture2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (130)· patent assignee history

2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	130	2021–2026

Locations

Location	Patents	Span
TW	130	2021–2026