Inventor
JENNIFER I. BENNETT
Inventor
US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits18%
H01RElectrically-conductive connections12%
B23KSoldering or unsoldering6%
G01BMeasuring length, thickness or similar linear dimensions6%
G01RMeasuring electric variables6%
G06FElectric digital data processing6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
A43BCharacteristic features of footwear3%
A61BDiagnosis3%
A61MDevices for introducing media into, or onto, the body3%
PatentTitleYear
12,536,341Security technique for digital data on digital storage medium202612,389,547Hybrid mechanical drill202512,253,354Radio frequency identification based three-dimensional metrology202512,189,763Securing digital data by automatic mechanism incapacitating data storage device202512,100,910Shape-memory alloy lock for connectors202411,906,574Hybrid socket warp indicator202411,699,884Electromagnetic shielding of heatsinks with spring press-fit pins202311,617,519Needle electrode for position-dependent injection202311,558,964Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention202311,517,072Adaptive electrostatic discharge and electric hazard footwear202211,445,650Localized rework using liquid media soldering202211,211,760Stutter step press-fit connector insertion process202111,175,100Heat sinks using memory shaping materials2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (13)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 13 | 2021–2026 |