Inventor

Fuchao Wang

Inventor
Plano, TX, US

Overview

28→
Patents
2002–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices14%
H01LSemiconductor devices12%
Y10TTechnical subjects covered by former us classification11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
B41JTypewriters8%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H01CResistors5%
H05BElectric heating4%
H10BElectronic memory devices4%
PatentTitleYear
11,106,193Neural network-based error compensation method, system and device for 3D printing202110,959,122Method and device for transmitting data202110,654,714Heating system and method for microfluidic and micromechanical applications202010,403,424Method to form magnetic core for integrated magnetic devices201910,276,787Integrated anisotropic magnetoresistive device201910,230,273Electricity transmission sending method and device, and system201910,206,247Closed loop temperature controlled circuit to improve device stability201910,068,769Methods and apparatus for preventing counter-doping during high temperature processing20189,899,334'Methods and apparatus for alignment marks'20189,842,895'Single photomask high precision thin film resistor'20179,443,801'Method to reduce metal fuse thickness without extra mask'20169,434,166'Heating system and method for microfluidic and micromechanical applications'20169,305,688'Single photomask high precision thin film resistor'20169,165,853'Closed loop temperature controlled circuit to improve device stability'20159,059,174'Method to reduce metal fuse thickness without extra mask'20158,925,835'Microfluidic nozzle formation and process flow'20158,927,909'Closed loop temperature controlled circuit to improve device stability'20158,798,448'Heating system and method for microfluidic and micromechanical applications'20148,493,171'Dual thin film precision resistance trimming'20138,242,876'Dual thin film precision resistance trimming'20128,110,117'Method to form a recess for a microfluidic device'20127,964,474'Use of field oxidation to simplify chamber fabrication in microfluidic devices'20117,881,594'Heating system and method for microfluidic and micromechanical applications'20117,514,714'Thin film power MOS transistor, apparatus, and method'20097,465,660'Graded/stepped silicide process to improve MOS transistor'20086,953,925'Microlens integration'20056,586,320'Graded/stepped silicide process to improve mos transistor'20036,350,684'Graded/stepped silicide process to improve MOS transistor'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2020Patents assigned to ST MICROELECTRONICS INC (18)· patent assignee history
2002–2008Based in Richardson, TX, US· patent location history
2005–2020Based in Plano, TX, US· patent location history
2012–2015Patents assigned to WANG FUCHAO (7)· patent assignee history
2012–2015Patents assigned to FANG MING (3)· patent assignee history
2012–2015Patents assigned to LE NEEL OLIVIER (3)· patent assignee history
2016–2019Patents assigned to TEXAS INSTRUMENTS INC (6)· patent assignee history
2019Based in Shenzhen, CN· patent location history
2021Based in Beijing, CN· patent location history
2021Based in Xi'an, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ST MICROELECTRONICS INC182002–2020
WANG FUCHAOself72012–2015
TEXAS INSTRUMENTS INC62016–2019
FANG MING32012–2015
LE NEEL OLIVIER32012–2015
Locations
LocationPatentsSpan
Plano, Texas, US222005–2020
Richardson, Texas, US32002–2008
Beijing, CN12021
Xi'an, CN12021
Shenzhen, CN12019