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Inventor

Scott Howard

Inventor
South Bend, IN, US

Overview

4→
Patents
1998–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
G02BOptical elements, systems or apparatus14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
A47BTables7%
H05KPrinted circuits7%
H10DInorganic electric semiconductor devices7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
10,410,989Inter-chip alignment201910,050,027Quilt packaging system with mated metal interconnect nodules and voids20189,620,473'Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment'20175,709,365'Adjustable book support'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998Based in Hindman, KY, US· patent location history
2017–2019Patents assigned to INDIANA INTEGRATED CIRCUITS LLC (3)· patent assignee history
2017–2019Patents assigned to UNIV NOTRE DAME DU LAC (3)· patent assignee history
2017–2019Based in South Bend, IN, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INDIANA INTEGRATED CIRCUITS LLC32017–2019
UNIV NOTRE DAME DU LAC32017–2019
Locations
LocationPatentsSpan
South Bend, IN, US32017–2019
Hindman, KY, US11998