Inventor
Hideki Sumi
Inventor
Yamanashi, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits47%
Y10TTechnical subjects covered by former us classification28%
G05BControl or regulating systems in general6%
Y02PClimate change mitigation technologies in the production or processing of goods4%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
G01CMeasuring distances, levels or bearings2%
G01DMeasuring not specially adapted for a specific variable2%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock2%
G01RMeasuring electric variables2%
G06FElectric digital data processing2%
PatentTitleYear
11,029,672Manufacturing system and method of granting authority202110,798,859Component mounting method202010,308,444Component mounting method201910,278,320Method of upgrading version of program in component mounting line201910,165,718Component replenishment support method and component replenishment support system in component mounting line201810,045,470Component mounting method201810,015,920Component mounting method in component mounting system20189,999,169Component mounting method20189,961,820Component replenishment support method and component replenishment support system in component mounting line20189,908,719'Component mounting method'20189,801,318'Component verification method and component verification system'20179,084,384'Component supply method in component mounting device'20158,844,124'Operation instruction display technique for an electronic component mounting system'20148,712,572'Electronic component mounting machine and operating instruction method for the same'20148,646,174'Device and method for mounting electronic components'20148,549,735'Component-mounting device, component-mounting system, and component-mounting method'20138,245,833'Substrate transport apparatus and substrate transport method'20128,140,176'Electronic component mounting system and electronic component mounting method'20128,046,907'Electronic component placement method'20117,506,434'Electronic parts mounting method'20097,119,550'Capacitance difference detecting circuit and MEMS sensor'20066,918,176'Mounting apparatus of electronic parts and mounting methods of the same'20056,578,261'Part-mounting system comprising a plurality of part mounting devices and method of part mounting'20036,550,135'Method of part mounting'20036,356,352'Component mounter and mounting method'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2009Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (5)· patent assignee history
2002–2021Based in Fukuoka, JP· patent location history
2006Based in Kasugai, JP· patent location history
2009Based in Chikugo, JP· patent location history
2011–2014Patents assigned to PANASONIC CORP (7)· patent assignee history
2012–2015Patents assigned to SUMI HIDEKI (7)· patent assignee history
2013–2014Patents assigned to AWATA YOSHIAKI (2)· patent assignee history
2013–2019Based in Yamanashi, JP· patent location history
2015–2021Patents assigned to PANASONIC IP MAN CO LTD (11)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC IP MAN CO LTD | 11 | 2015–2021 |
| PANASONIC CORP | 7 | 2011–2014 |
| SUMI HIDEKIself | 7 | 2012–2015 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 5 | 2002–2009 |
| AWATA YOSHIAKI | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yamanashi, JP | 12 | 2013–2019 |
| Fukuoka, JP | 11 | 2002–2021 |
| Chikugo, JP | 1 | 2009 |
| Kasugai, JP | 1 | 2006 |