Inventor
YOSHIHIRO OKAWA
Inventor
JP
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Bprimary
H05BElectric heating21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01LSemiconductor devices16%
G05BControl or regulating systems in general7%
G06NComputing arrangements based on specific computational models7%
B28BShaping clay or other ceramic compositions5%
C04BLime, magnesia5%
B25JManipulators2%
F03DWind motors2%
F05BIndexing scheme relating to wind, spring, weight, inertia or like motors, to machines or engines for liquids covered by subclasses f03b, f03d and f03g2%
PatentTitleYear
12,550,231Ceramic structure and method manufacturing ceramic structure202612,525,472Structure and heating device202612,452,961Ceramic structure and wafer system202512,238,827Base structure and wafer placing device202512,183,601Structural body and heating apparatus202412,142,498Ceramic structure and wafer system202412,016,087Heater and method of production of same202411,923,227Electrostatic chuck and method for manufacturing same202411,856,659Board-like structure and heater system202311,818,813Wafer-use member, wafer-use system, and method for manufacturing wafer-use member202311,619,915Reinforcement learning method and reinforcement learning system202311,543,789Reinforcement learning method, recording medium, and reinforcement learning system202311,366,433Reinforcement learning method and device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to FUJITSU LTD (3)· patent assignee history
2022–2026Based in JP· patent location history
2023–2026Patents assigned to KYOCERA CORP (10)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KYOCERA CORP | 10 | 2023–2026 |
| FUJITSU LTD | 3 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 13 | 2022–2026 |