Inventor
Mutsumi Nagano
Inventor
Kanagawa, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
Y10TTechnical subjects covered by former us classification29%
PatentTitleYear
5,937,278'Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer'19995,812,381'Lead frame and integrated circuit package using the lead frame'19985,481,798'Etching method for forming a lead frame'19965,437,764'Lead frame and manufacturing method therefor'19955,349,238'Semiconductor device'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1999Patents assigned to SONY CORP (5)· patent assignee history
1994–1999Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 5 | 1994–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 5 | 1994–1999 |