Inventor
SONG-BOR LEE
Inventor
TW
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices30%
H01LSemiconductor devices28%
B82YSpecific uses or applications of nanostructures23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
12,581,677Passivation layers for semiconductor devices202612,432,986Spacer structures for semiconductor devices202512,426,322Core-shell nanostructures for semiconductor devices202512,040,381Method of manufacturing semiconductor devices and semiconductor devices202411,990,510Semiconductor device and manufacturing method thereof202411,961,762Package component with stepped passivation layer202411,929,422Passivation layers for semiconductor devices202411,881,530Spacer structures for semiconductor devices202411,824,089Core-shell nanostructures for semiconductor devices202311,695,055Passivation layers for semiconductor devices202311,621,343Method of manufacturing semiconductor devices and semiconductor devices202311,450,567Package component with stepped passivation layer202211,233,119Core-shell nanostructures for semiconductor devices202211,233,149Spacer structures for semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 14 | 2022–2026 |