Inventor
Ji Hwang Kim
Inventor
Cheonan-si, KR
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H05KPrinted circuits3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
B23KSoldering or unsoldering2%
G01RMeasuring electric variables2%
G02BOptical elements, systems or apparatus2%
H04NPictorial communication, e.g. television2%
H10BElectronic memory devices2%
PatentTitleYear
10,966,320Gap supporter for printed circuit board, and package including gap supporter for printed circuit board and insulation sheet coupled thereto202110,750,112Substrate structures for image sensor modules and image sensor modules including the same202010,685,921Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same202010,651,224Semiconductor package including a redistribution line202010,361,170Semiconductor package201910,224,272Semiconductor package including a rewiring layer with an embedded chip201910,199,319Printed circuit board and semiconductor package including the same201910,192,855Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line201910,141,286Methods of manufacturing semiconductor packages201810,026,724Semiconductor package and method of manufacturing the same20189,997,446Semiconductor package including a rewiring layer with an embedded chip20189,893,018'Alignment mark for semiconductor device'20189,728,424'Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate'20179,646,895'Semiconductor package and manufacturing method thereof'20179,515,057'Semiconductor package and method of manufacturing the semiconductor package'20169,449,930'Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same'20169,425,111'Semiconductor package'20169,202,767'Semiconductor device and method of manufacturing the same'20159,159,651'Semiconductor packages having TSV and adhesive layer'20159,099,541'Method of manufacturing semiconductor device'20159,064,941'Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same'20158,963,336'Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same'20158,912,048'Method of fabricating semiconductor device including a substrate attached to a carrier'20148,802,495'Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (23)· patent assignee history
2014–2015Based in Bucheon-si, KR· patent location history
2015–2019Patents assigned to KIM JI HWANG (3)· patent assignee history
2015–2016Patents assigned to KIM JI-HWANG (3)· patent assignee history
2015Patents assigned to AN JIN-HO (2)· patent assignee history
2015Patents assigned to JUNG DEOK-YOUNG (2)· patent assignee history
2015–2020Based in Cheonan-si, KR· patent location history
2019Based in Hwasung, KR· patent location history
2020Based in Hwaseong-si, KR· patent location history
2021Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 23 | 2014–2020 |
| KIM JI HWANGself | 3 | 2015–2019 |
| KIM JI-HWANGself | 3 | 2015–2016 |
| AN JIN-HO | 2 | 2015 |
| JUNG DEOK-YOUNG | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 15 | 2015–2020 |
| Bucheon-si, KR | 5 | 2014–2015 |
| Seoul, KR | 1 | 2021 |
| Hwaseong-si, KR | 1 | 2020 |
| Hwasung, KR | 1 | 2019 |