Inventor
Tetsuro Nishimura
Inventor
Osaka, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering25%
C22CAlloys17%
H05KPrinted circuits12%
A61MDevices for introducing media into, or onto, the body7%
C22BProduction and refining of metals7%
Y10TTechnical subjects covered by former us classification5%
B41JTypewriters3%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
10,987,949De-curling device and image forming apparatus including same202110,960,664Inkjet recording apparatus202110,427,220Nanoparticle production method, production device and automatic production device201910,329,642Solder alloy and joint thereof201910,286,497Lead-free solder alloy20199,999,936Solder wire bobbinless coil20189,999,945Solder alloy20189,339,893'Lead-free solder alloy'20168,999,519'Solder joint'20158,652,269'Flux composition and soldering paste composition'20148,557,021'Method of regulating nickel concentration in lead-free solder containing nickel'20138,163,061'Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin'20128,147,746'Apparatus for precipitation/separation of excess copper in lead-free solder'20127,861,909'Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath'20117,591,873'Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin'20096,699,306'Control method for copper density in a solder dipping bath'20046,296,722'Lead-free solder alloy'20016,044,769'In-pipe work apparatus'20005,772,101'Wave soldering machine'19985,487,868'Tin based solder alloy containing lead, antimony, and tellurium'19965,417,771'Soldering flux'19954,915,704'Tube assembly with a breakaway plug'19904,911,696'Branch tube'19904,899,903'Tube assembly provided with a breakaway plug'19904,816,219'Low-temperature solder composition'1989D0297367'Manifold for connecting tubes in blood administration equipment'19884,657,535'Medical needle device and medical equipment having the same'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1990Patents assigned to TERUMO CORP (5)· patent assignee history
1987–1988Based in Fujinomiya, JP· patent location history
1990Based in Shizuoka, JP· patent location history
1995–2019Patents assigned to NIHON SUPERIOR CO LTD (9)· patent assignee history
1996–2021Based in Osaka, JP· patent location history
2000Based in Machida, JP· patent location history
2001–2015Patents assigned to NIHON SUPERIOR SHA CO LTD (8)· patent assignee history
2001–2019Based in Suita, JP· patent location history
2012–2018Patents assigned to NISHIMURA TETSURO (7)· patent assignee history
2021Patents assigned to KYOCERA DOCUMENT SOLUTIONS INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIHON SUPERIOR CO LTD | 9 | 1995–2019 |
| NIHON SUPERIOR SHA CO LTD | 8 | 2001–2015 |
| NISHIMURA TETSUROself | 7 | 2012–2018 |
| TERUMO CORP | 5 | 1987–1990 |
| KYOCERA DOCUMENT SOLUTIONS INC | 2 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 14 | 1996–2021 |
| Suita, JP | 5 | 2001–2019 |
| Shizuoka, JP | 3 | 1990 |
| Fujinomiya, JP | 2 | 1987–1988 |
| Machida, JP | 1 | 2000 |