Inventor
Robert Jeffrey Day
Inventor
Dryden, NY, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits35%
Y10TTechnical subjects covered by former us classification35%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests20%
C23FNon-mechanical removal of metallic material from surface10%
PatentTitleYear
6,775,907'Process for manufacturing a printed wiring board'20046,544,584'Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate'20036,212,769'Process for manufacturing a printed wiring board'20016,063,481'Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate'20005,817,405'Circuitized substrate with same surface conductors of different resolutions'19985,707,893'Method of making a circuitized substrate using two different metallization processes'19985,311,660'Methyl chloroform-free desmear process in additive circuitization'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2004Patents assigned to IBM (7)· patent assignee history
1994–2004Based in Dryden, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 7 | 1994–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dryden, New York, US | 7 | 1994–2004 |