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Inventor

Hirofumi Ichihara

Inventor
Tokyo, JP

Overview

1→
Patents
2018
Patent span
Physics
Primary field (CPC G)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing20%
G01BMeasuring length, thickness or similar linear dimensions20%
G01NInvestigating or analysing materials by determining their chemical or physical properties20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
10,134,614Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to EBARA CORP (1)· patent assignee history
2018Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP12018
Locations
LocationPatentsSpan
Tokyo, JP12018