Inventor
Tatsuo Asakawa
Inventor
Tokyo, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices50%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
C23CCoating metallic material6%
H01LSemiconductor devices6%
PatentTitleYear
10,996,554Substrate with an electrically conductive film, substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device202110,606,166Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device202010,347,485Reflective mask blank, method for manufacturing same, reflective mask, method for manufacturing same, and method for manufacturing semiconductor device201910,191,365Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor device20199,726,969'Reflective mask blank, method of manufacturing same, reflective mask and method of manufacturing semiconductor device'20179,720,315'Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor device'20179,535,318'Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device'20179,377,679'Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to HOYA CORP (8)· patent assignee history
2016–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HOYA CORP | 8 | 2016–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2016–2021 |