Inventor
HSI-CHENG HSU
Inventor
TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
B81BMicrostructural devices or systems, e.g. micromechanical devices13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
G02BOptical elements, systems or apparatus9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
12,583,740Inter-poly connection for parasitic capacitor and die size improvement202612,466,727Extended acid etch for oxide removal202512,454,455Semiconductor structure and method of making202512,283,568Wafer bonding alignment202512,271,006Multifunctional collimator for contact image sensors202512,242,181Photomask assembly and method of forming the same202512,157,667Anti-stiction process for MEMS device202412,092,839Multifunctional collimator for contact image sensors202412,085,518Systems and methods for wafer bond monitoring202412,054,382Roughness selectivity for MEMS movement stiction reduction202411,815,471Systems and methods for wafer bond monitoring202311,789,360Photomask assembly and method of forming the same202311,782,284Multifunctional collimator for contact image sensors202311,742,320Wafer bonding alignment202311,726,342Multifunctional collimator for contact image sensors202311,655,146Extended acid etch for oxide removal202311,655,138Roughness selectivity for MEMS movement stiction reduction202311,543,363Systems and methods for wafer bond monitoring202311,454,820Multifunctional collimator for contact image sensors202211,448,891Multifunctional collimator for contact image sensors202211,407,636Inter-poly connection for parasitic capacitor and die size improvement202211,392,024Photomask assembly and method of forming the same202211,305,980Anti-stiction process for MEMS device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (23)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 23 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 23 | 2022–2026 |