Inventor
Isamu Togashi
Inventor
Matsumoto, JP
Overview
Patents· 53 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B41Jprimary
B41JTypewriters84%
B05BSpraying apparatus3%
H10NElectric solid-state devices not otherwise provided for3%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
C23CCoating metallic material2%
F16KValves2%
H01LSemiconductor devices2%
H01RElectrically-conductive connections2%
PatentTitleYear
11,104,130Flow-path member, liquid ejecting head and liquid ejecting apparatus202110,730,295Flow-path member, liquid ejecting head and liquid ejecting apparatus202010,717,277Flow path structure, liquid ejecting head, and liquid ejecting apparatus202010,549,533Flow path structure, liquid ejecting head, and liquid ejecting apparatus202010,328,689Flow path structure, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of flow path structure201910,286,658Flow path member, liquid ejecting head, and liquid ejecting apparatus201910,286,662Flow-path member, liquid ejecting head and liquid ejecting apparatus201910,272,683Flow path structure, liquid ejecting head, and liquid ejecting apparatus201910,226,952Liquid ejecting apparatus201910,173,429Liquid ejecting head, method for manufacturing the same, and liquid ejecting apparatus201910,124,586Flow path structure, liquid ejecting head, and liquid ejecting apparatus201810,112,394Liquid ejecting head unit and liquid ejecting apparatus201810,059,099Liquid ejecting head and liquid ejecting apparatus201810,046,575Liquid spray device20189,950,532Liquid ejecting head and manufacturing method thereof20189,950,531Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus20189,878,557'Flow-path member, liquid ejecting head and liquid ejecting apparatus'20189,873,251Method of manufacturing flow path member, flow path member, and liquid ejecting head20189,849,702Liquid ejecting apparatus20179,844,938Liquid ejecting head and liquid ejecting apparatus20179,834,004Flow channel structure and liquid ejecting apparatus20179,827,763Liquid ejecting head and liquid ejecting apparatus20179,815,286'Liquid ejecting apparatus'20179,789,686'Liquid ejecting head and liquid ejecting apparatus'20179,789,685'Flow path structure, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of flow path structure'20179,731,507'Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus'20179,707,760'Flow path structure, liquid ejecting head, and liquid ejecting apparatus'20179,662,883'Liquid ejecting head and liquid ejecting apparatus'20179,481,167'Liquid ejecting head and liquid ejecting apparatus'20169,427,964'Liquid ejecting head and liquid ejecting apparatus'20169,427,965'Liquid ejecting head and liquid ejecting apparatus'20169,415,596'Liquid ejecting head and liquid ejecting apparatus'20169,403,362'Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus'20169,393,783'Liquid ejecting head and liquid ejecting apparatus'20169,346,269'Flow path structure, liquid ejecting head, and liquid ejecting apparatus'20169,327,501'Inkjet-head and ink jet printer'20169,315,020'Flow-path member, liquid ejecting head and liquid ejecting apparatus'20169,308,725'Liquid ejecting head and liquid ejecting apparatus'20169,278,530'Inkjet-head and ink jet printer'20169,272,294'Liquid ejecting head and liquid ejecting apparatus'20169,254,656'Liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head'20169,211,706'Liquid ejecting apparatus and liquid ejecting head unit'20159,090,069'Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus'20159,090,057'Piezoelectric unit, liquid ejecting head, and liquid ejecting apparatus'20158,905,524'Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus'20148,894,186'Liquid ejecting apparatus'20148,870,354'Flow path member, liquid ejection head, liquid ejection apparatus and liquid storing unit'20148,672,459'Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus'20148,636,344'Piezoelectric unit, liquid ejecting head, and liquid ejecting apparatus'20148,622,529'Liquid ejecting head and liquid ejecting apparatus'20148,502,354'Break pattern of silicon wafer, silicon wafer, and silicon substrate'20138,398,313'Liquid ejecting head and liquid ejecting apparatus'20138,308,276'Liquid ejecting head and liquid ejecting apparatus'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2021Patents assigned to SEIKO EPSON CORP (53)· patent assignee history
2012–2016Patents assigned to TOGASHI ISAMU (7)· patent assignee history
2012–2021Based in Matsumoto, JP· patent location history
2013Patents assigned to IHARA YUKI (1)· patent assignee history
2013Patents assigned to KOBAYASHI YUTAKA (1)· patent assignee history
2014Patents assigned to KODA TAKAFUMI (1)· patent assignee history
2018Based in Nagano, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 53 | 2012–2021 |
| TOGASHI ISAMUself | 7 | 2012–2016 |
| IHARA YUKI | 1 | 2013 |
| KOBAYASHI YUTAKA | 1 | 2013 |
| KODA TAKAFUMI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Matsumoto, JP | 52 | 2012–2021 |
| Nagano, JP | 1 | 2018 |