Inventor

CHIH-CHENG LIU

Inventor
CN

Overview

43→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices13%
H10BElectronic memory devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10DInorganic electric semiconductor devices9%
C23CCoating metallic material4%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium2%
G11CStatic stores2%
H01FMagnets1%
PatentTitleYear
12,538,476Semiconductor structure and method for forming semiconductor structure202612,505,876—202512,494,368Photoresist and method202512,487,523In-situ deposition and densification treatment for metal-comprising resist layer202512,463,034Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202512,374,548Photoresist layer outgassing prevention202512,349,372Method of forming semiconductor structure and semiconductor structure202512,336,161Semiconductor structure and manufacturing method thereof202512,336,160Static random access memory cell and method for forming same202512,334,415Through vias with test structure202512,324,148Method for forming semiconductor structure and a semiconductor202512,288,759Semiconductor redistribution structure with integrated test pad and method for preparing the same202512,272,554Method of manufacturing a semiconductor device202512,271,113Method of manufacturing a semiconductor device202512,255,125Semiconductor structure and manufacturing method thereof202512,222,643Method of manufacturing a semiconductor device and pattern formation method202512,191,350Method of manufacturing semiconductor structure and semiconductor structure202512,159,836Semiconductor structure and method for fabricating a semiconductor structure202412,159,787Method of manufacturing a semiconductor device and pattern formation method202412,159,828Semiconductor structure with shielding structure for through silicon via and manufacturing method thereof202412,153,346Photoresist for semiconductor fabrication202412,135,501Method of manufacturing a semiconductor device202412,132,077Semiconductor structure and manufacturing method thereof202412,106,799Forming method of sense amplifier and layout structure of sense amplifier202412,075,610Semiconductor structure manufacturing method and semiconductor structure202412,069,850Semiconductor structure, manufacturing method thereof, and memory having bit line conducting layers covering the bit line contact layer and the insulating layer202412,057,315Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202412,044,966Photoresist for semiconductor fabrication202412,027,456Semiconductor structure and manufacturing method thereof202412,002,675Photoresist layer outgassing prevention202411,930,632Gate structure and manufacturing method thereof202411,882,689Memory and manufacturing method thereof202411,864,377Semiconductor structure and method for manufacturing same202411,843,026Method for manufacturing semiconductor structure and semiconductor structure202311,822,237Method of manufacturing a semiconductor device202311,798,881Anti-fuse structure and method for fabricating same, as well as semiconductor device202311,784,046Method of manufacturing a semiconductor device202311,726,405Photoresist for semiconductor fabrication202311,705,332Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202311,569,149Semiconductor structure and manufacturing method thereof202311,387,239Semiconductor memory device structure202211,342,292Bonding pad structure for memory device and method of manufacturing the same202211,189,621DRAM array, semiconductor layout structure therefor and fabrication method2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to CHANGXIN MEMORY TECH INC (26)· patent assignee history
2021–2026Based in CN· patent location history
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2023–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANGXIN MEMORY TECH INC262021–2026
TAIWAN SEMICONDUCTOR MFG CO LTD172023–2025
Locations
LocationPatentsSpan
CN262021–2026
TW172023–2025