Inventor
Allan R. Knoll
Inventor
Endicott, NY, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits20%
C23CCoating metallic material16%
Y10TTechnical subjects covered by former us classification16%
H10NElectric solid-state devices not otherwise provided for8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B29CShaping or joining of plastics4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
PatentTitleYear
7,702,373'Superconducting articles, and methods for forming and using same'20107,365,271'Superconducting articles, and methods for forming and using same'20087,162,286'Superconducting articles, and methods for forming and using same'20077,071,148'Joined superconductive articles'20066,515,233'Method of producing flex circuit with selectively plated gold'20036,383,401'Method of producing flex circuit with selectively plated gold'20026,337,004'High adhesion performance roll sputtered strike layer'20026,284,329'Method of forming adherent metal components on a polyimide substrate'20016,235,411'Process for coating a substrate with metallic layer'20016,194,076'Method of forming adherent metal components on a polyimide substrate'20015,525,369'Method for metallizing through holes in thin film substrates, and resulting devices'19965,461,203'Electronic package including lower water content polyimide film'19955,372,848'Process for creating organic polymeric substrate with copper'19945,288,541'Method for metallizing through holes in thin film substrates, and resulting devices'19945,053,104'Method of plasma etching a substrate with a gaseous organohalide compound'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2002Patents assigned to IBM (9)· patent assignee history
1991–2003Based in Endicott, NY, US· patent location history
2002Patents assigned to INTERNAT FLEX TECHNOLOGIES INC (1)· patent assignee history
2006–2010Patents assigned to SUPERPOWER INC (4)· patent assignee history
2006–2010Based in Guilderland, NY, US· patent location history
2008Based in Duanesburg, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 9 | 1991–2002 |
| SUPERPOWER INC | 4 | 2006–2010 |
| INTERNAT FLEX TECHNOLOGIES INC | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 11 | 1991–2003 |
| Guilderland, New York, US | 3 | 2006–2010 |
| Duanesburg, New York, US | 1 | 2008 |