Inventor
THORSTEN SCHARF
Inventor
DE
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
H05KPrinted circuits5%
A01FProcessing of harvested produce3%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters3%
B23KSoldering or unsoldering2%
B30BPresses in general2%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles2%
PatentTitleYear
12,575,429Semiconductor package having a lead frame and a clip frame202612,568,888Square baler202612,540,662Gear assembly for driving a ram of a square baler202612,431,450Device including semiconductor chips and method for producing such device202512,394,697Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw202512,249,561Semiconductor device arrangement with compressible adhesive202512,218,098Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate202512,211,824Power semiconductor package having first and second lead frames202512,154,886Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof202412,027,481Device including semiconductor chips and method for producing such device202412,027,490Semiconductor device and method for fabricating the same202411,955,415Semiconductor device package comprising a pin in the form of a drilling screw202411,915,999Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element202411,862,600Method of forming a chip package and chip package202411,710,684Package with separate substrate sections202311,600,558Plurality of transistor packages with exposed source and drain contacts mounted on a carrier202311,569,186Device including semiconductor chips and method for producing such device202311,515,244Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture202211,502,042Processing of one or more carrier bodies and electronic components by multiple alignment202211,469,161Lead frame-based semiconductor package202211,309,277Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate202211,264,356Batch manufacture of packages by sheet separated into carriers after mounting of electronic components2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INFINEON TECHNOLOGIES AG (18)· patent assignee history
2022–2026Based in DE· patent location history
2024–2025Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (2)· patent assignee history
2026Patents assigned to USINES CLAAS FRANCE SAS (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 18 | 2022–2026 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 2 | 2024–2025 |
| USINES CLAAS FRANCE SAS | 2 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 22 | 2022–2026 |