Inventor

Benjamin N. Eldridge

Inventor

Danville, CA, US

Overview

1994–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 229 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary

G01RMeasuring electric variables24%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%

H05KPrinted circuits10%

Y10TTechnical subjects covered by former us classification10%

H01RElectrically-conductive connections6%

B23KSoldering or unsoldering6%

C25DProcesses for the electrolytic or electrophoretic production of coatings5%

Y02PClimate change mitigation technologies in the production or processing of goods5%

C23CCoating metallic material2%

PatentTitleYear

10,598,697Shielding for vertical probe heads2020 10,578,649Vertical probe array having a tiled membrane space transformer2020 10,527,647Probe head with inductance reducing structure2020 10,266,402Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such2019 10,132,833Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates2018 9,958,476Floating nest for a test socket2018 9,702,904'Non-linear vertical leaf spring'2017 9,030,222'Sharpened, oriented contact tip structures'2015 8,896,336'Testing techniques for through-device vias'2014 8,697,301'Fuel cell using carbon nanotubes'2014 8,513,969'Apparatus and method of testing singulated dies'2013 8,513,942'Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby'2013 8,485,418'Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out'2013 8,476,538'Wiring substrate with customization layers'2013 8,427,183'Probe card assembly having an actuator for bending the probe substrate'2013 8,383,958'Method to build robust mechanical structures on substrate surfaces'2013 8,373,428'Probe card assembly and kit, and methods of making same'2013 8,354,855'Carbon nanotube columns and methods of making and using carbon nanotube columns as probes'2013 8,203,351'Probing apparatus with guarded signal traces'2012 8,130,007'Probe card assembly with carbon nanotube probes having a spring mechanism therein'2012 8,033,838'Microelectronic contact structure'2011 7,990,164'Method of designing a probe card apparatus with desired compliance characteristics'2011 7,977,956'Method and apparatus for probe card alignment in a test system'2011 7,967,621'Electrical contactor, especially wafer level contactor, using fluid pressure'2011 7,956,633'Stacked guard structures'2011 7,952,375'AC coupled parameteric test probe'2011 7,948,252'Multilayered probe card'2011 7,936,177'Providing an electrically conductive wall structure adjacent a contact structure of an electronic device'2011 7,930,219'Method and system for designing a probe card'2011 7,920,989'Remote test facility with wireless interface to local test facilities'2011 7,898,242'Probe card assembly with an interchangeable probe insert'2011 7,897,435'Re-assembly process for MEMS structures'2011 7,884,006'Method to build a wirebond probe card in a many at a time fashion'2011 7,880,489'Printing of redistribution traces on electronic component'2011 7,868,632'Composite motion probing'2011 7,852,094'Sharing resources in a system for testing semiconductor devices'2010 7,845,072'Method and apparatus for adjusting a multi-substrate probe structure'2010 7,841,863'Spring interconnect structures'2010 7,825,674'Probe card configuration for low mechanical flexural strength electrical routing substrates'2010 7,821,255'Test system with wireless communications'2010 7,808,259'Component assembly and alignment'2010 7,798,822'Microelectronic contact structures'2010 7,737,709'Methods for planarizing a semiconductor contactor'2010 7,731,503'Carbon nanotube contact structures'2010 7,732,713'Method to build robust mechanical structures on substrate surfaces'2010 7,733,106'Apparatus and method of testing singulated dies'2010 7,724,004'Probing apparatus with guarded signal traces'2010 7,722,371'Electrical contactor, especially wafer level contactor, using fluid pressure'2010 7,714,603'Predictive, adaptive power supply for an integrated circuit under test'2010 7,714,598'Contact carriers (tiles) for populating larger substrates with spring contacts'2010 7,701,243'Electronic device testing using a probe tip having multiple contact features'2010 7,699,616'High density planar electrical interface'2010 7,692,433'Sawing tile corners on probe card substrates'2010 7,675,311'Wireless test system'2010 7,675,301'Electronic components with plurality of contoured microelectronic spring contacts'2010 7,674,112'Resilient contact element and methods of fabrication'2010 7,671,614'Apparatus and method for adjusting an orientation of probes'2010 7,659,736'Mechanically reconfigurable vertical tester interface for IC probing'2010 7,649,368'Wafer level interposer'2010 7,642,794'Method and system for compensating thermally induced motion of probe cards'2010 7,634,849'Method of assembling and testing an electronics module'2009 7,621,044'Method of manufacturing a resilient contact'2009 7,622,935'Probe card assembly with a mechanically decoupled wiring substrate'2009 7,618,281'Interconnect assemblies and methods'2009 7,616,016'Probe card assembly and kit'2009 7,613,591'Remote test facility with wireless interface to local facilities'2009 7,601,039'Microelectronic contact structure and method of making same'2009 7,593,872'Method and system for designing a probe card'2009 7,592,821'Apparatus and method for managing thermally induced motion of a probe card assembly'2009 7,579,269'Microelectronic spring contact elements'2009 7,560,941'Method and system for compensating thermally induced motion of probe cards'2009 7,557,596'Test assembly including a test die for testing a semiconductor product die'2009 7,555,836'Method of making lithographic contact elements'2009 7,553,165'Spring interconnect structures'2009 7,550,842'Integrated circuit assembly'2009 7,548,055'Testing an electronic device using test data from a plurality of testers'2009 7,534,654'Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'2009 7,524,194'Lithographic type microelectronic spring structures with improved contours'2009 7,498,825'Probe card assembly with an interchangeable probe insert'2009 7,488,917'Electric discharge machining of a probe array'2009 7,482,822'Apparatus and method for limiting over travel in a probe card assembly'2009 7,471,094'Method and apparatus for adjusting a multi-substrate probe structure'2008 7,463,043'Methods of probing an electronic device'2008 7,459,795'Method to build a wirebond probe card in a many at a time fashion'2008 7,458,816'Shaped spring'2008 7,455,540'Electrical contactor, especially wafer level contactor, using fluid pressure'2008 7,435,108'Variable width resilient conductive contact structures'2008 7,400,157'Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes'2008 7,396,236'Wafer level interposer'2008 7,385,411'Method of designing a probe card apparatus with desired compliance characteristics'2008 7,371,072'Spring interconnect structures'2008 7,352,196'Probe card assembly and kit'2008 7,347,702'Contact carriers (tiles) for populating larger substrates with spring contacts'2008 7,342,405'Apparatus for reducing power supply noise in an integrated circuit'2008 7,335,057'High density planar electrical interface'2008 7,325,302'Method of forming an interconnection element'2008 7,312,618'Method and system for compensating thermally induced motion of probe cards'2007 7,287,322'Lithographic contact elements'2007 7,285,968'Apparatus and method for managing thermally induced motion of a probe card assembly'2007 7,262,611'Apparatuses and methods for planarizing a semiconductor contactor'2007 7,251,884'Method to build robust mechanical structures on substrate surfaces'2007 7,253,651'Remote test facility with wireless interface to local test facilities'2007 7,245,137'Test head assembly having paired contact structures'2007 7,245,120'Predictive, adaptive power supply for an integrated circuit under test'2007 7,230,437'Mechanically reconfigurable vertical tester interface for IC probing'2007 7,225,538'Resilient contact structures formed and then attached to a substrate'2007 7,218,094'Wireless test system'2007 7,218,127'Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component'2007 7,204,008'Method of making an electronics module'2007 7,202,677'Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'2007 7,202,687'Systems and methods for wireless semiconductor device testing'2007 7,202,682'Composite motion probing'2007 7,196,531'Method of manufacturing a probe card'2007 7,195,503'Electrical contactor, especially wafer level contactor, using fluid pressure'2007 7,189,077'Lithographic type microelectronic spring structures with improved contours'2007 7,179,662'Semiconductor fuse covering'2007 7,168,162'Method of manufacturing a probe card'2007 7,169,646'Interconnect assemblies and methods'2007 7,140,883'Contact carriers (tiles) for populating larger substrates with spring contacts'2006 7,142,000'Mounting spring elements on semiconductor devices, and wafer-level testing methodology'2006 7,127,811'Methods of fabricating and using shaped springs'2006 7,128,587'Probe card covering system and method'2006 7,122,760'Using electric discharge machining to manufacture probes'2006 7,119,564'Method and system for compensating thermally induced motion of probe cards'2006 7,108,546'High density planar electrical interface'2006 7,092,902'Automated system for designing and testing a probe card'2006 7,086,149'Method of making a contact structure with a distinctly formed tip structure'2006 7,084,650'Apparatus and method for limiting over travel in a probe card assembly'2006 7,073,254'Method for mounting a plurality of spring contact elements'2006 7,071,714'Method and system for compensating for thermally induced motion of probe cards'2006 7,071,715'Probe card configuration for low mechanical flexural strength electrical routing substrates'2006 7,064,566'Probe card assembly and kit'2006 7,061,257'Probe card assembly'2006 7,059,047'Sockets for â€œspringedâ€ semiconductor devices'2006 7,053,637'Method for testing signal paths between an integrated circuit wafer and a wafer tester'2006 7,048,548'Interconnect for microelectronic structures with enhanced spring characteristics'2006 7,047,638'Method of making microelectronic spring contact array'2006 7,010,854'Re-assembly process for MEMS structures'2006 6,972,578'Method and system for compensating thermally induced motion of probe cards'2005 6,960,923'Probe card covering system and method'2005 6,949,942'Predictive, adaptive power supply for an integrated circuit under test'2005 6,948,941'Interconnect assemblies and methods'2005 6,940,093'Special contact points for accessing internal circuitry of an integrated circuit'2005 6,939,474'Method for forming microelectronic spring structures on a substrate'2005 6,937,037'Probe card assembly for contacting a device with raised contact elements'2005 6,913,468'Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods'2005 6,888,362'Test head assembly for electronic components with plurality of contoured microelectronic spring contacts'2005 6,864,105'Method of manufacturing a probe card'2005 6,840,374'Apparatus and method for cleaning test probes'2005 6,838,893'Probe card assembly'2005 6,835,898'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'2004 6,827,584'Interconnect for microelectronic structures with enhanced spring characteristics'2004 6,825,052'Test assembly including a test die for testing a semiconductor product die'2004 6,825,422'Interconnection element with contact blade'2004 6,807,734'Microelectronic contact structures, and methods of making same'2004 6,791,176'Lithographic contact elements'2004 6,780,001'Forming tool for forming a contoured microelectronic spring mold'2004 6,778,406'Resilient contact structures for interconnecting electronic devices'2004 6,764,869'Method of assembling and testing an electronics module'2004 6,759,311'Fan out of interconnect elements attached to semiconductor wafer'2004 6,741,085'Contact carriers (tiles) for populating larger substrates with spring contacts'2004 6,741,092'Method and system for detecting an arc condition'2004 6,729,019'Method of manufacturing a probe card'2004 6,727,580'Microelectronic spring contact elements'2004 6,727,579'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'2004 6,724,209'Method for testing signal paths between an integrated circuit wafer and a wafer tester'2004 6,714,828'Method and system for designing a probe card'2004 6,713,374'Interconnect assemblies and methods'2004 6,705,876'Electrical interconnect assemblies and methods'2004 6,672,875'Spring interconnect structures'2004 6,669,489'Interposer, socket and assembly for socketing an electronic component and method of making and using same'2003 6,664,628'Electronic component overlapping dice of unsingulated semiconductor wafer'2003 6,655,023'Method and apparatus for burning-in semiconductor devices in wafer form'2003 6,657,455'Predictive, adaptive power supply for an integrated circuit under test'2003 6,640,432'Method of fabricating shaped springs'2003 6,642,625'Sockets for springed semiconductor devices'2003 6,627,980'Stacked semiconductor device assembly with microelectronic spring contacts'2003 6,624,648'Probe card assembly'2003 6,621,260'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,616,966'Method of making lithographic contact springs'2003 6,615,485'Probe card assembly and kit, and methods of making same'2003 6,603,324'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,597,187'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,551,844'Test assembly including a test die for testing a semiconductor product die'2003 6,534,856'Sockets for springed semiconductor devices'2003 6,520,778'Microelectronic contact structures, and methods of making same'2003 6,509,751'Planarizer for a semiconductor contactor'2003 6,491,968'Methods for making spring interconnect structures'2002 6,482,013'Microelectronic spring contact element and electronic component having a plurality of spring contact elements'2002 6,483,328'Probe card for probing wafers with raised contact elements'2002 6,479,308'Semiconductor fuse covering'2002 6,476,630'Method for testing signal paths between an integrated circuit wafer and a wafer tester'2002 6,475,822'Method of making microelectronic contact structures'2002 6,468,098'Electrical contactor especially wafer level contactor using fluid pressure'2002 6,456,103'Apparatus for reducing power supply noise in an integrated circuit'2002 6,456,099'Special contact points for accessing internal circuitry of an integrated circuit'2002 6,441,315'Contact structures with blades having a wiping motion'2002 6,429,029'Concurrent design and subsequent partitioning of product and test die'2002 6,339,338'Apparatus for reducing power supply noise in an integrated circuit'2002 6,336,269'Method of fabricating an interconnection element'2002 6,330,164'Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device'2001 6,268,015'Method of making and using lithographic contact springs'2001 6,255,126'Lithographic contact elements'2001 6,246,247'Probe card assembly and kit, and methods of using same'2001 6,232,149'Sockets for \"springed\" semiconductor devices'2001 6,215,196'Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals'2001 6,184,053'Method of making microelectronic spring contact elements'2001 6,150,186'Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive'2000 6,110,823'Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method'2000 6,050,829'Making discrete power connections to a space transformer of a probe card assembly'2000 6,043,563'Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals'2000 6,033,935'Sockets for \"springed\" semiconductor devices'2000 6,032,356'Wafer-level test and burn-in, and semiconductor process'2000 5,998,228'Method of testing semiconductor'1999 5,994,152'Fabricating interconnects and tips using sacrificial substrates'1999 5,983,493'Method of temporarily, then permanently, connecting to a semiconductor device'1999 5,974,662'Method of planarizing tips of probe elements of a probe card assembly'1999 5,912,046'Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component'1999 5,897,326'Method of exercising semiconductor devices'1999 5,884,398'Mounting spring elements on semiconductor devices'1999 5,878,486'Method of burning-in semiconductor devices'1999 5,864,946'Method of making contact tip structures'1999 5,832,601'Method of making temporary connections between electronic components'1998 5,829,128'Method of mounting resilient contact structures to semiconductor devices'1998 5,806,181'Contact carriers (tiles) for populating larger substrates with spring contacts'1998 5,772,451'Sockets for electronic components and methods of connecting to electronic components'1998 5,773,780'Method of severing bond wires and forming balls at their ends'1998 5,601,740'Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires'1997 5,346,518'Vapor drain system'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2004Based in Hopewell Junction, NY, US· patent location history

1997–2020Patents assigned to FORMFACTOR INC (222)· patent assignee history

1997–2020Based in Danville, CA, US· patent location history

2005Based in Danvile, CA, US· patent location history

2012–2017Patents assigned to ELDRIDGE BENJAMIN N (14)· patent assignee history

2013–2015Patents assigned to MATHIEU GAETAN L (8)· patent assignee history

2013–2015Patents assigned to GRUBE GARY W (5)· patent assignee history

2013–2015Patents assigned to KHANDROS IGOR Y (4)· patent assignee history

2019Based in Livermore, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FORMFACTOR INC	222	1997–2020
ELDRIDGE BENJAMIN Nself	14	2012–2017
MATHIEU GAETAN L	8	2013–2015
GRUBE GARY W	5	2013–2015
KHANDROS IGOR Y	4	2013–2015

Locations

Location	Patents	Span
Danville, California, US	223	1997–2020
Hopewell Junction, New York, US	4	1994–2004
Livermore, California, US	1	2019
Danvile, California, US	1	2005