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Inventor

Wei-Li Lai

Inventor
Taichung, TW

Overview

1→
Patents
2018
Patent span
Electricity
Primary field (CPC H)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10BElectronic memory devices33%
H10NElectric solid-state devices not otherwise provided for33%
PatentTitleYear
10,056,432Self-rectifying RRAM cell structure having two resistive switching layers with different bandgaps and RRAM 3D crossbar array architecture2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
2018Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WINBOND ELECTRONICS CORP12018
Locations
LocationPatentsSpan
Taichung, TW12018